Tag Archives: VIA

VIA Technologies Introduces COMe-8X91 COM Express Module

VIA COMe-8X91 COM Express Module (COM)

VIA Technologies introduced their COMe-8X91 COM Express Module. The VIA COMe-8X91 COM features the 800MHz VIA Eden X2 dual core processor, VIA VX900 media system processor (MSP), 1GB of onboard DDR3, type 10 pin-outs, two SATA II ports, GigaLAN port, eight USB 2.0 ports shared (one USB client port), HD audio digital interface and two serial ports. The VIA COMe-8X91 module is ideal for medical, advanced gaming, test and measurement, industrial (machine vision system) and military applications.

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VIA Technologies Unveils COMe-8X92 COM Express and QSM-8Q90 QSeven Modules

VIA Technologies introduced the COMe-8X92 and QSM-8Q90 modules. The VIA COMe-8X92 module is based on the industry standard Computer-on-Module (COM) Express Compact form factor. It is ideal for dynamic applications like medical, advanced gaming, industrial automation and digital signage. The VIA QSM-8Q90 module measures just 70mm x 70mm and is based on the new embedded QSeven form factor. It is ideal for power constrained handheld applications like medical, advanced gaming, military and test and measurement equipment.

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WIN Enterprises PL-80320 Embedded System

WIN Enterprises introduced their PL-80320 embedded system. The PL-80320 features a VIA Nano/Eden processor, AMI SPI BIOS, VIA VX900 chipset, DDR3 SO-DIMM socket (up to 4GB) eight COM ports, dual GbE LAN,four USB 2.0 ports, and compact sealed housing. The fanless box computer is ideal for industrial automation, kiosk, POS, and digital signage applications.

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VIA Eden X2 Dual-core Processors

VIA Technologies introduced the Eden X2 dual-core processor for industrial and commercial embedded systems. VIA Eden X2 processors combine two 64-bit, superscalar VIA Eden cores on one die. The Eden X2 are natively 64-bit compatible. VIA Eden X2 processors are based on the latest 40nm manufacturing process using a VIA NanoBGA2 package of 21mm x 21mm with a die size of 11mm x 6mm. VIA Eden X2 processors and are fully pin-to-pin compatible with VIA Eden, VIA C7 and VIA Nano E-Series processors. VIA Eden X2 Processors are sampling now. Systems and boards featuring the VIA Eden X2 will be available in Q2 2011.

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VIA Vision Intelligence Display Touch Screens for Embedded Systems

VIA Technologies introduced the VIA VID series of industrial-class touch screen displays. VIA VID Series displays are available in both ruggedized and open frame configurations. All ruggedized configurations feature IP65 water resistance compliancy and operating temperatures of -10°C to 70°. The TFT LCD panels are ideal for interactive kiosk, POI and POS embedded systems in harsh industrial environments. VIA VID series displays are available now in 15″ and 12.1″ form factors. Later this year, 19″, 10.4″ and 7″ sizes will also be available.

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ACROSSER AR-N8601 Micro Box Network Appliance

ACROSSER Technology rolled out the Micro Box AR-N8601 networking appliance. The AR-N8601 Micro Box features the VIA CN700, VT8237R+ chipsets and Eden ULV 500MHz CPU. The AR-N8601 network appliance support up to 1GB DDR2 system memory at 400MHz. ACROSSER AR-N8601 Micro Box networking appliance is available now. It is ideal for applications like UTM (Unified Threat Management), WAS (Web Access Management), VPN, and anti-spam mail solution.

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VIA Nano 3000 Series Processors

VIA Technologies launched the Nano 3000 Series processors. The VIA Nano 3000 is based on the 64-bit superscalar Isaiah architecture. Available at speeds from 1.0GHz to 2.0GHz, VIA Nano 3000 Series processors deliver up to 20% higher performance using up to 20% less power than current VIA Nano processors and boast a number of new features including support for the SSE4 multimedia instruction set and VIA VT virtualization technology.

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