Tag Archives: TMS320C6472

G.PAK Voice-over-Packet DSP Framework for TI TMS320C6472 Multicore DSP

Adaptive Digital Technologies introduced integration-ready DSP solutions for high-end voice applications.The DSP software solutions leverage Texas Instruments’ (TI) TMS320C6472 six-core digital signal processor. The solution enables engineers to implement high-density, multi-channel, voice-over-packet applications in the shortest possible time with maximum processing performance. Product developers can minimize solution development time while maximizing the power efficiency of their VoIP applications.

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Sundance EVP6472 Embedded Development Platform

Sundance announced the EVP6472 embedded development platform. The EVP6472 off-the-shelf multiprocessor, multicore solution features dual Texas Instruments (TI) TMS320C6472 Digital Signal Processors (DSPs). The EVP6472 offers design support from 3L’s Diamond multiprocessor tool-suite. Diamond enables easy access to the on-board 12 C64x+ cores and allows the designer to rapidly build, model, test, and iterate different design architectures by moving tasks between the processor cores. The EVP6472 is available for order with shipping in December 2009. Prices start at $2000.00 for a limited time.

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