GreenBase Technology introduced the GQ4430 Qseven module. The GQ4430 is based on Texas Instruments OMAP4430 embedded application processor. The new GreenBase Qseven module features a SGX540 3D Graphics Engine, DDR2 SDRAM (up to 1 GB), external SD card support, fast Ethernet, HDMI, 24-bit LVDS, TTL display interface, CSI2 camera interface, two USB 2.0, three UART, SPI and I2C. The GreenBase GQ4430 Qseven module supports Android 4.03 and Windows Embedded Compact 7. It is ideal for embedded mobile devices.
MSC Vertriebs GmbH introduced the MSC Q7-TI8168 embedded module. The Q7-TI8168 module is compliant with the Qseven standard 1.20. The ARM based embedded board features a Texas Instruments Integra C6A8168 processor and an ARM Cortex-A8 core. The digital signal processor in the ARM core takes over the computing intensive image processing in real-time and unloads the ARM processor. The MSC Q7-TI8168 is ideal for demanding image processing functions in industrial automation, medicine, transportation and security systems.
Texas Instruments introduced their MSP430F673x/F672x ultra-low-power 16-bit microcontroller family. There are 24 MCUs in the TI F673x/F672x family. The MSP430F673x/F672x microcontrollers guarantee no interruption of operation through a backup capable microcontroller supporting real-time clock (RTC) operation and power management from the main power supply and up to two separate auxiliary supplies. The new Texas Instruments devices are immediately now. Prices start at $2.00 for 1K-units.
Texas Instruments announced the TMS320C66x multicore digital signal processors. The multicore TI C66x DSP devices are based on the KeyStone multicore architecture. The C66x family include the TMS320C6671 (one core), TMS320C6672 (two cores), TMS320C6674 (four cores) and TMS320C6678 (eight cores) digital signal processors. Each high-speed core (1.5 GHz, 1.25 GHz or 1 GHz) is a true fixed- and floating-point DSP. The TI DSPs are ideal for software defined radios (SDRs), radar, surveillance and imaging cameras.
Gumstix introduced their Overo Sand Computer-On-Module. The Overo Sand COM features the Texas Instruments OMAP3503 application processor, 256MB of DDR (no NAND Flash), up to 1200 Dhrystone MIPS performance, microSD card slot, and TPS65950 Power Management. The Gumstix Overo Sand COM is an entry level board and is ideal for simple product designs and production needs. The Overo Sand Computer-On-Module is priced at $99 each (1,000 units quantity).
Texas Instruments launched their new Hercules safety microcontrollers. The new platform consists of the TMS470M, TMS570 and RM4x ARM Cortex-based microcontroller families. The new TI microcontrollers are designed specifically for IEC 61508 and ISO 26262 safety critical applications. The MCUs are ideal for medical, industrial and transportation applications. Hercules microcontrollers are available now for order. Prices range from $5 – $30 USD each (in 10K unit quantities).
Texas Instruments announced their DRV8662 piezo haptic driver for mobile consumer and industrial designs. The TI DRV8662 features an integrated 105-V boost converter, power diode, and 50-V to 200-V peak-to-peak (Vpp) fully-differential amplifier. The DRV8662 is available now in a 4mm x 4mm x 0.9mm QFN package It is priced at $1.75 in quantities of 1,000. The DRV8662 haptics driver makes it easy to include effects like localized vibrations and frequency variations in both touch screen-input devices and those without a touch screen. The driver is ideal for mobile phones, tablets, computer accessories, home appliances, and industrial automation consoles.
Texas Instruments introduced the OpenLink open source Wi-Fi and Bluetooth daughter card for AM18x evaluation modules (EVMs). The standalone WiLink 6.0 daughter card is a combo wireless connectivity add-on card. It is based on the LS Research TiWi module with Texas Instruments WiLink 6.0 (WL1271) solution. The standalone daughter card is available for $249. The production-ready WiLink 6.0 (WL1271) OpenLink module is bundled in the AM18x Sitara ARM EVM + WL1271 Development Kit, which is priced at $1,150.
Texas Instruments announced the H.E.A.T. (harsh environment acquisition terminal) evaluation module (EVM). The high-temperature data acquisition system includes a complete set of TI signal chain components qualified for extreme temperature operation from -55°C to 210°C. The H.E.A.T. EVM is test-oven ready and qualified to operate up to 200 hours at oven temperatures of up to 200°C. The board is available now for $5,749. All individual high-temperature semiconductor components in the H.E.A.T. EVM are available in both a high-temperature ceramic package, and in Known Good Die (KGD) for smallest package integration.
Texas Instruments introduced their C2000 Concerto dual-core microcontroller series. The TI Concerto 32-bit MCU devices include a C28x core, control peripherals, an ARM Cortex-M3 core, connectivity peripherals, and safety and security features. The Concerto microcontrollers are available now in a 144 QFP package. Prices start at $6.99 (at 1000 units). The Concerto dual-core microcontrollers are ideal for intelligent motor control, renewable energy, smart grid, digital power and electric vehicles.