Ronetix introduced the PM9G45 computer-on-module. The SODIMM-sized CPU module features the Atmel’s ARM926-based AT91SAM9G45 system-on-chip (SoC), 128MB DDR2, 256MB NAND Flash, 10/100Mbps Ethernet MAC controller, USB Host and On-The-Go ports, four USART interfaces, dual high-speed multi media card interfaces. The PM9G45 have a touch screen controller and a LCD controller that supports resolutions up to 800×600 pixels. The SODIMM-sized board measures only 2.6 by 1.3 inches (67x35mm). The Ronetix PM9G45 is ideal for industrial control systems, data loggers, point-of-sale (PoS) terminals, alarm systems, medical equipment and other embedded systems. The Ronetix PM9G45 CPU module is available now.
By Joe Gianelli and Tom Huang
System integration continues to drive the semiconductor design market. This is most obvious when looking at the increased system integration associated with System on Chip (SoC) design over the last few years. Integrating complex hardware features with complex software applications onto one silicon device makes the validation process for today’s SoC designs a tricky one to say the least.
What have been increasingly popular to aid in this complex validation process are FPGA prototype systems. They run extremely fast, almost as fast as the production SoC, and have doubled in capacity every 18 months for the last 5 years. They also enable real world system interfaces to DDRAM, PCI, Ethernet, while using high-speed serial interfaces over 10 Gb/s.
Despite their current strides in speed, capacity, and real world high-speed interfaces, using these FPGA devices to help verify and validate SoC designs are difficult at best due to the many and long FPGA P&R compile times and poor visibility. InPA Systems proposes to address these issues with their active debug and full visibility technology.
Teridian Semiconductor introduced the 78M6618 (6618) energy measurement system-on-chip (SoC). The 6618 is a highly integrated, single phase, eight-outlet, PDU power measurement, and monitoring SoC. The 78M6618 SoC can monitor and control eight channels at once and can extended to 32 or more channels by connecting multiple chips together. The 6618 chip is ideal for data center power distribution units (PDUs) and applications in the smart home, including intelligent power strips and circuit breaker panels. The 78M6618 is available now and priced at $5.90 in quantities of 1,000.
The Acadia Vision Processor II, from Sarnoff, is a system-on-a-chip (SoC) with real-time, portable, and low power consumption for embedded systems, vision processing, and control. Acadia II features an integrated ARM11 MPCore, small form factor, and low power. The SoC performs real-time contrast enhancement, stabilization, multi-sensor fusion, and tracking. Acadia II is ideal for portable and wearable vision systems, security and surveillance platforms, manned and unmanned aerial and ground vehicles, border and perimeter protection, and vision-aided GPS-denied navigation.
Texas Instruments (TI) introduced the new TMS320DM8168 DaVinci video system-on-chip (SoC). The DM8168 consolidates all of the capture, compression, display and control functionalities of a high definition (HD), multi-channel system on a single chip. The DaVinci video SoC features a 1 GHz ARM Cortex-A8 and a 1 GHz TI C674x digital signal processor (DSP) core. The DM8168 reduces system electronic bill of materials (eBOM) costs by 50%. It replaces the functionality of over 10 discrete components. The DM8168 DaVinci video SoC will begin sampling in the second quarter.
Texas Instruments Incorporated (TI) announced the DMVA1 SoC. With DMVA1, engineers can deploy smart analytics functions such as people counting, trip zone, intelligent motion detection, camera tamper detection and streaming metadata. By coupling the vision co-processor with smart analytics all on a single chip, designers can reduce the cost of video analytics-enabled IP cameras by an order of magnitude. The DMVA1 video security camera SoC will begin sampling in the second quarter to early adopter video security customers.
Texas Instruments developed a new System-on-a-Chip (SoC) architecture based on their multicore digital signal processors (DSPs) with integrated fixed and floating point capabilities. TI’s new multicore SoCs run at up to 1.2GHz and features an engine with up to 256 GMACS and 128 GFLOPS. The multicore SoCs offer over five times the performance of existing solutions in the market and offer vendors a common platform to accelerate the development of infrastructure products such as wireless base stations, media gateways and video infrastructure equipment.
Triad Semiconductor introduced the TSX1001 mixed-signal ARM Cortex-M0 processor. The TSX1001 ARM Cortex-M0 processor features 16-bit ADC, 12-bit DAC, and uncommitted op-amps. Engineering samples of the Triad Semiconductor TSX1001 will be available in May 2010. The TSX1001 will be supported by industry standard embedded software tool flows such as the ARM RealView development suite.
Triad Semiconductor announced the Mocha-1 array. According to Triad, the Mocha-1 is the first system-on-chip (SoC) to integrate the ARM Cortex-M0 with the via-configurable analog and digital functions. Triad’s Mocha-1 array enables electronic system designers to customize analog and digital features with lower power consumption and greater system cost savings than last-generation ASIC solutions.
STMicroelectronics introduced the FLI7510 full high-definition (FHD) H.264/MPEG System-on-Chip (SoC) ICs for the worldwide flat-panel digital TV (DTV) market. The FLI7510 is the first member of the new family (codenamed ‘Freeman’) of performance- and software-scalable SoCs, addressing mainstream and high-end segments of the DTV market. The FLI7510 is designed to meet the increasingly stringent system-energy consumption standards for ‘green’ consumer electronics equipment. The FLI7510 SoC is now sampling to qualified customers.