Tag Archives: Qualcomm

Digi ConnectCore 3G Embedded Module

Digi International announced the ConnectCore 3G embedded module. The ConnectCore 3G features Qualcomm Gobi technology, which supports High Speed Packet Access (HSPA) or Evolution-Data Optimized (EV-DO) networks. With ConnectCore 3G, develoeprs can develop one solution for use anywhere in the world with the same hardware. It is ideal for remote device management solutions in energy, fleet management, digital signage, industrial automation, and security/access control applications. Digi ConnectCore 3G Digi JumpStart Kits will be available in December 2010 for $499.

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Qualcomm MSM7x30 Smartphone Chipset

Qualcomm is sampling the new MSM7x30 smartphone chipset family. The MSM7x30 family features a strong emphasis on multimedia performance, supporting high-definition video recording and playback, exceptional graphics with dedicated 2D and 3D cores, and an overall chip design optimized for a highly responsive, immersive web experience. The first devices based on the flagship MSM7x30 family of chipsets are expected to launch commercially before the end of 2010.

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