Tag Archives: Miniaturization

VIA Mobile-ITX Open Form Factor Specification for Embedded Devices

VIA Technologies developed the Mobile-ITX open form factor specification for the creation of ultra-compact and portable embedded devices. Mobile-ITX defines a uniquely compact 6cm x 6cm computer-on-module specification designed to enable an easier and less resource intensive development cycle for a range of ultra-compact, portable embedded systems. The VIA Embedded Platform Division will announce the first commercial CPU module based on the Mobile-ITX form factor in Q1 2010.

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