Tag Archives: I/O

WinSystems Debuts ISM-TRM-RELAY, ISM-TRM-COMBO Isolated Digital I/O Signal Conditioning Boards

WinSystems ISM-TRM-COMBO Octal Isolated In/Out/Relay Signaling Conditioning Module

WinSystems announced the ISM-TRM-RELAY and ISM-TRM-COMBO isolated digital signal conditioning and termination boards. The ISM-TRM-RELAY features sixteen independent, Single Pole Double Throw (SPDT) relays. The ISM-TRM-COMBO features eight optically isolated inputs, eight optically isolated outputs, and eight Form C relays on one board. The ISM-TRM-RELAY is priced at $299 and the ISM-TRM-COMBO is priced at $255.

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Diamond Systems Opal-MM-1616 PC/104 Optoisolated I/O Module

Diamond Systems introduced the Opal-MM-1616 PC/104 I/O module. The Opal-MM-1616 board features 16 unidirectional optoisolated inputs and 16 relay outputs. It is supported by Diamond’s Universal Driver software library. The Universal Driver software is a high-level programming library for all of Diamond’s data acquisition products. The OPMM-1616-XT is ideal for industrial automation, transportation, energy, instrumentation, aerospace, military, and medical markets and applications. The Opal-MM-1616-XT Optoisolated Input and Relay Output PC/104 Module is available now for $195.

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GE Intelligent Platforms VME-6500 6U VME Multifunction I/O Board

GE Intelligent Platforms introduced the VME-6500 6U VME Multifunction I/O Board. The VME-6500 module features eight analog input channels, eight analog output channels, 16 digital input channels and 16 digital output channels. Analog inputs are software-programmable and analog outputs feature programmable voltage and current rates. Digital input channels are capable of multiple voltages and current ranges, and feature programmable input thresholds and de-bounce times. Digital outputs support high voltage and current drivers, and are protected for short circuit, over current and over temperature conditions.

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Acromag IP560 and IOS-560 CAN Bus Modules for Embedded Systems

Acromag introduced the IP560 and IOS-560 CAN bus modules for interfacing network sensors and actuators to control systems. The IP560 is an Industry Pack ANSI/VITA-4 card that plugs into VME, CompactPCI, and PCI bus mezzanine carrier cards or single-board computers in embedded systems. IOS-560 is designed for use within Acromag’s I/O Server industrial PC, which is a small fanless box computer for mobile computing, machine control, and test applications. Both CAN bus interface modules feature two channels with optional isolation. Each channel has an NXP SJA1000 CAN controller with a TJA1041 transceiver. Extended temperature models support -40 to 85°C operation. Single quantity pricing starts at $500.

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WinSystems PCM-MIO-G-AD-1 and PCM-MIO-G-DA-1 PC/104 Analog I/O Boards

WinSystems introduced the PCM-MIO-G-AD-1 and PCM-MIO-G-DA-1 PC/104-compatible analog I/O boards. The PCM-MIO-G-AD-1 is a 16-channel, 16-bit analog input card and the PCM-MIO-G-DA-1 is an 8-channel, 12-bit analog output card. PCM-MIO-G-AD-1 and PCM-MIO-G-DA-1 expansion boards are feature accurate analog and digital I/O over a -40° to +85°C temperature range. Both modules support 48-lines of digital I/O. Both WinSystems modules are supplied with free drivers for C, Linux, and Windows XP Embedded. The PCM-MIO-G-AD-1 list price is $249 and the PCM-MIO-G-DA-1 list price is $279.

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Avalue ECM-945GSE+ Single Board Computer

Avalue introduced the ECM-945GSE+ (Plus) modularized single board computer. The ECM-945GSE+ SBC features the Intel Atom N270 processor, DDRII memory with maximum memory capacity of 1G, 36-bit LVDS LCD and CRT+LVDS dual-screen display output, two Mini PCIe and SATA interfaces, gigabit ultra-speed Ethernet, and six sets of USB 2.0 connectivity interfaces.

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VIA EMIO-3110, EMIO-3430, and EMIO-3210 Em-ITX I/O Expansion Modules

VIA Technologies introduced the EMIO-3110, EMIO-3430, and EMIO-3210 Em-ITX I/O expansion modules. The boards are ideal for digital signage, POI, gaming, kiosk, industrial automation, and fleet management. All three Em-ITX I/O expansion modules are fully compatible with the VIA EITX-3000 board and forthcoming Em-ITX form factor boards. The EMIO-3110, EMIO-3430, and EMIO-3210 Em-ITX I/O expansion modules are available now.

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FeaturePak Embedded I/O Expansion Card Standard

The FeaturePak I/O module standard provides a compact and low-cost method of adding I/O to board-level embedded computers. FeaturePaks can be used as snap-in customization modules for commercial, off-the-shelf single-board computers (SBCs) and computer-on-module (COM) baseboards, or as functional blocks on fully-custom embedded electronics. FeaturePak modules interface to the host system via a single low-cost, high-density, 230-pin connector, which carries PCI Express, USB, I2C, and several other host-interface signals, plus up to 100 points of application I/O per module. The host interface is CPU agnostic and is compatible with both Intel- and RISC-architecture systems. The modules can easily be integrated into embedded designs along with Qseven, COM Express, SUMIT, PCI/104-Express, EBX, and EPIC.

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New Embedded System I/O Expansion Standard

A new embedded system I/O expansion standard, originated by Diamond Systems, will be launched at Embedded World 2010 in Nuremberg, Germany on March 2, 2010. The new mezzanine-style standard defines a highly compact, low cost way to add application-oriented capabilities to single-board computers (SBCs), computer-on-module (COM) baseboards, and fully-custom embedded electronics. The new I/O expansion standard enable engineers to add application-specific capabilities to SBCs and COM baseboards without adding height to the system.

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ADLINK MNET-4XMO Distributed Motion and I/O Solutions

ADLINK Technology introduced the MNET-4XMO series of distributed motion and I/O solutions. The MNET-4XMO provide motion control of up to 256 axes and I/O control of up to 2,016 control points through the integration of dedicated and time-deterministic motion & I/O field buses: Motionnet and High Speed Link (HSL). ADLINK’s distributed machine automation solutions are specifically design to significantly decrease wiring and assembling cost by providing cost-effective motion control and ample I/O. Engineers will benefit from the combination of high-performance motion control and the fast 1 ms response time of the I/O modules.

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