Texas Instruments announced the SN65LVDS324 image sensor receiver. The new TI IC acts as a dedicated LVDS bridge between image sensors and processors. The SN65LVDS324 is ideal for surveillance IP cameras and video conferencing systems, as well as industrial, consumer and professional video recording equipment. The chip is available in a 4.5mm by 7mm, 59-ball PBGA (ZQL) package. The suggested retail price of the IC is $2.65 in 1000-unit quantities.
Texas Instruments announced the stackable bq76PL536 battery management integrated circuit. The TI bq76PL536 increases the life of rechargeable lithium-ion battery packs and maximizes available energy. The IC features analog-to-digital converters for independent cell voltage and temperature protection, cell balancing and isolated chip-to-chip communication. The bq76PL536 and AEC-Q100 automotive-qualified bq76PL536-Q1 battery monitors are available now in a 64-pin HTQFP package. Pricing starts at $4.30 (quantities of 1,000). The battery monitor, balancer and protector is ideal for hybrid and electric vehicles, power tools and uninterruptible power source (UPS) applications.
ZMD introduced the ZIOL2201 line driver and level shifter IC. The ZMD ZIOL2201 features high-voltage I/O channel, integrated DC/DC converter, IO-Link communication standard support, operating temperature of -40°C to +85°C, and 4mm x 4mm QFN24 package. The output driver is a push pull stage that reaches an RDSon of less than 6.6 Ohms. The IC is ideal for sensors and actuators used in the harsh environment of automation applications. Samples of the ZIOL2201 are available now. Prices start at EUR 2.62 (volumes of 1000 devices).
Integrated Device Technology introduced the LDS7000 and LDS7001 touch screen controller IC’s. The LDS7000 and LDS7001 are optimized for IDT’s single-layer multi-touch projected capacitive touch screen technology. They do not not require cross-over isolation points like other solutions. The new ICs are sampling now. The LDS7000 is available in a 5×5 mm, 40-pin TQFN package. It is priced at $2.50 in 10,000-unit quantities. The IDT LDS7001 is available in a 6×6 mm, 48-pin TQFN package. It is priced at $2.95 in 10,000-unit quantities.
Microchip Technology introduced the RE46C190 3V photo smoke-detector IC with horn driver and boost regulator. The RE46C190 features low-voltage operation with programmable calibration and operating modes. With the smoke-detector IC, the desired operating modes can be selected and calibrated during manufacturing. A single Lithium battery can power the chip for up to ten years. Two Alkaline batteries may also be used to power the RE46C190. The RE46C190 smoke-detector IC is available in a 16-pin SOIC 150 mil, package for $0.94 each, in 10,000-unit quantities. The RE46C190 is available now.
Dialog Semiconductor introduced the DA8223 real time 2D to 3D video conversion chip for portable devices. The device is supports 3D capable displays from 3.8″ smartphones up to 10″ tablet PCs. The DA8223 features a parallax barrier screen driver that lets users view 3D content without the need for glasses. The 5x5mm 81-ball UFBGA chip can be mounted on the PCB, between the application processor and 3D display, or on the display module as a chip-on-flex. DA8223 samples will be available early in 2011.
The BAL-2593D5U and BAL-2690D3U ICs, from STMicroelectronics, enable designers to connect an antenna to a Bluetooth transceiver using a single chip. The BAL-2593D5U and BAL-2690D3U are integrated baluns, used to convert the antenna signal to a balanced pair of signals as required by the Bluetooth transceiver. The new devices occupy up to 70% less printed-circuit-board area, simplify design and assembly, and ensure better balanced signal channels with low losses. The BAL-2593D5U and BAL-2690D3U are in production now, in 4-bump flip-chip packages, priced at $0.25 for a minimum order of 5000 pieces.
ZMDI announced the ZSSC3017 16-bit sensor signal conditioning IC (SSC). The ZMDI ZSSC3017 features high accuracy amplification, 16-bit precision analog-to-digital conversion, and an 18-bit DSP for linearization and calibration functions. The CMOS device is ideal for altimeter/barometer systems, data merging with GPS receivers, medical gas and infusion pumps, and robotics. The ZSSC3017 is available as die for wafer bonding or in a TSSOP14 package. Packaged parts are priced at 1.13 Euro / 1.59 US$ in volumes of 10k. Samples and wafer material are available now.
Summit Microelectronics announced the SMB328A and SMB328B programmable battery charger integrated circuits (IC) for single-cell Li-Ion, Li-Polymer, and Li-FePO4 powered systems. The SMB328A and SMB328B enable engineers to create slim industrial designs with faster charging times. The SMB328A and SMB328B are available now in production quantities. The SMB328A is priced at $1.28 and the SMB328B is priced at $1.23 each in quantities of 10,000 units.
STMicroelectronics announced the STM6600 and STM6601 smart pushbutton on/off controller chips for battery-powered embedded systems like e-readers, tablets, media players, smartphones, and digital cameras. The STM6600 and STM6601 on/off controller chips will enable next-generation mobile products to offer easy-to-use ‘power-up’, ‘power-down’ and ‘unfreeze/reset’ functions that will prevent damage to the end-user product. The STM6600 and STM6601 are in volume production now. Several configurations are available, allowing designers to optimize protection for their designs, priced from $0.65 in quantities of 10,000.