Tag Archives: High-Temperature

Texas Instruments H.E.A.T. Evaluation Module

Texas Instruments announced the H.E.A.T. (harsh environment acquisition terminal) evaluation module (EVM). The high-temperature data acquisition system includes a complete set of TI signal chain components qualified for extreme temperature operation from -55°C to 210°C. The H.E.A.T. EVM is test-oven ready and qualified to operate up to 200 hours at oven temperatures of up to 200°C. The board is available now for $5,749. All individual high-temperature semiconductor components in the H.E.A.T. EVM are available in both a high-temperature ceramic package, and in Known Good Die (KGD) for smallest package integration.

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Microchip High-Temperature Portfolio for AEC-Q100 Grade 0

Microchip Technology introduced a portfolio of semiconductors specified for operation up to 150° C ambient — including 8- and 16-bit PIC microcontrollers (MCUs) and dsPIC Digital Signal Controllers (DSCs), serial EEPROM devices, and analog products. Qualified and tested in accordance with AEC-Q100 Grade 0 requirements, the devices are optimum for under-the-hood automotive applications; extreme-environment industrial applications, such as down-hole oil drilling and lighting; and for medical applications such as devices that are sterilized in autoclaves. Engineers can now add intelligence directly into high-temperature applications, where the silicon can be mounted directly onto high-temperature assemblies.

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