The FeaturePak I/O module standard provides a compact and low-cost method of adding I/O to board-level embedded computers. FeaturePaks can be used as snap-in customization modules for commercial, off-the-shelf single-board computers (SBCs) and computer-on-module (COM) baseboards, or as functional blocks on fully-custom embedded electronics. FeaturePak modules interface to the host system via a single low-cost, high-density, 230-pin connector, which carries PCI Express, USB, I2C, and several other host-interface signals, plus up to 100 points of application I/O per module. The host interface is CPU agnostic and is compatible with both Intel- and RISC-architecture systems. The modules can easily be integrated into embedded designs along with Qseven, COM Express, SUMIT, PCI/104-Express, EBX, and EPIC.
A new embedded system I/O expansion standard, originated by Diamond Systems, will be launched at Embedded World 2010 in Nuremberg, Germany on March 2, 2010. The new mezzanine-style standard defines a highly compact, low cost way to add application-oriented capabilities to single-board computers (SBCs), computer-on-module (COM) baseboards, and fully-custom embedded electronics. The new I/O expansion standard enable engineers to add application-specific capabilities to SBCs and COM baseboards without adding height to the system.