Dialog Semiconductor introduced the DA8223 real time 2D to 3D video conversion chip for portable devices. The device is supports 3D capable displays from 3.8″ smartphones up to 10″ tablet PCs. The DA8223 features a parallax barrier screen driver that lets users view 3D content without the need for glasses. The 5x5mm 81-ball UFBGA chip can be mounted on the PCB, between the application processor and 3D display, or on the display module as a chip-on-flex. DA8223 samples will be available early in 2011.
ZMDI announced the ZLED7012 and ZLED7022 LED control ICs. The ZLED7012 and ZLED7022 feature low-noise, constant-frequency charge pump DC/DC converters that can efficiently drive up to four (ZLED7012) or six (ZLED7022) strings of LEDs. The ZLED7012 and ZLED7022 come in a 12-pin UTQFN package (2mm x 2mm). The ZLED7012 is priced at €0.32 and the ZLED7022 is priced at €0.39. Both parts are available in mass production now. Full application kits, application notes, and an evaluation board are also available now.
VIA Technologies introduced the EPIA-M850 Mini-ITX board for multimedia embedded devices. The EPIA-M850 features a 64-bit VIA Nano E-Series processor, VIA VX900 media system processor, up to 8GB of DDR3 system memory, and the VIA ChromotionHD 2.0 video processor. The VIA ChromotionHD 2.0 video engine offers hardware acceleration for the latest VC1, H.264, MPEG-2 and WMV9 HD formats at screen resolutions of up to 1080p without affecting CPU load. The VIA EPIA-M850 is ideal for HD-intensive, commercial multimedia-centric devices.
ITTIA rolled out version 3.2 of their ITTIA DB SQL relational database for embedded systems and devices. ITTIA DB SQL’s multi-user capabilities enable applications on an embedded device to share data safely between different threads and processes. ITTIA DB SQL v3.2 uses shared memory areas to improve the performance of on-device communications. Shared memory is fully compatible with the existing TCP/IP transport, allowing data to be shared between both local and remote connections with the best possible performance. A free copy of ITTIA DB-SQL for evaluation is available now.
Microsoft Windows Embedded Standard 7 packs the Windows 7 operating system in a highly customizable and componentized form. The embedded OS is ideal for thin clients, digital signage, industrial controls, set-top boxes (STBs), connected media devices (CMDs), and TVs for consumers. With indows Embedded Standard 7, OEMs build enterprise devices with seamless connectivity. Windows Embedded Standard 7 features Windows Defender and Parental Controls for heightened security.
IDT (Integrated Device Technology) introduced the 5P49EE801, 5P49EE802, 5P49EE601, 5P49EE602, and 5P49EE502 VersaClock LP devices. The VersaClock low power devices are available in several package options, including 20-pin and 24-pin QFN. The new timing devices are sampling to qualified customers and range in price from $0.80 to $1.25 for 10,000 units. Evaluation boards are available for qualified customers. The VersaClock low power (LP) devices are programmable clock generators designed to reduce power consumption and optimize board layout in battery-operated consumer applications.
Avago Technologies developed a new miniature optical finger navigation (OFN) input system for mobile and consumer electronic devices. The OFN solution is user-friendly and features a low-power architecture and power management modes. The optical finger navigation is ideal for designers of electronic devices such as mobile phones, MP3 players, ultra-miniature PCs, game pads, digital cameras, and keyboards.
Shavlik Technologies announced an agentless solution that delivers complete and comprehensive patch management for Windows XP Embedded (XPe) devices commonly used in hundreds of applications. Windows XPe devices can include retail POS cash registers, slot machines, airport or train station kiosks, gas station self service pumps, and ATM-styled kiosks at movie theaters. The patch management solution helps secure Windows XP Embedded devices against viruses, worms, and hackers.
VIA Technologies developed the Mobile-ITX open form factor specification for the creation of ultra-compact and portable embedded devices. Mobile-ITX defines a uniquely compact 6cm x 6cm computer-on-module specification designed to enable an easier and less resource intensive development cycle for a range of ultra-compact, portable embedded systems. The VIA Embedded Platform Division will announce the first commercial CPU module based on the Mobile-ITX form factor in Q1 2010.
Lattice Semiconductor introduced the ispPAC-POWR1014-2 and ispPAC-POWR1014A-2. The new devices are the latest members of Power Manager II product family. The ispPAC-POWR1014-2 and ispPAC-POWR1014A-2 devices integrate higher voltage charge pumps with programmable current to control MOSFETs in Hot Swap and Sequencing applications. High volume (250KU+) pricing for the ispPAC-POWR1014-2 devices in the 48-pin TQFP package and industrial temperature range is $1.95, with the ispPAC-POWR1014A-2 devices priced 10% higher. Samples are available now.