Texas Instruments rolled out Microsoft Windows Embedded CE 6.0 R3 board support packages (BSPs) for OMAP-L1x floating-point DSP+ARM9 processors, Sitara AM1x ARM9 microprocessor units (MPUs) and associated evaluation modules (EVMs). The new BSPs enable developers to easily and quickly interface devices to Embedded CE. The BSPs include drivers and source code. Windows Embedded CE 6.0 R3 BSPs for OMAP-L1x and AM1x devices can be downloaded now for free.
The new Freescale i.MX51 evaluation kit (EVK) speeds and simplifies the development of compelling applications based on the Google Android platform and Freescale’s i.MX51 processor. The i.MX51 EVK is available now and ships with software BSPs on accompanying pre-flashed SD cards. In addition, Android OS BSP images for the i.MX51 processor can be downloaded from the Freescale website.
SYSGO announced board support package for the Freescale i.MX25 Platform Development Kit. The SYSGO’s board support package features multimedia, high speed, low power consumption, and the ELinOS professional grade Linux for the rapid development of demanding high reliability applications. ELinOS 5.0 with support for the Freescale i.MX25 processors is available now. ELinOS 5.0 is available for Linux and Windows hosted platforms.