Tag Archives: CE 6.0 R3

TI Windows Embedded CE 6.0 R3 BSP for OMAP-L1x, Sitara AM1x Processors

Texas Instruments rolled out Microsoft Windows Embedded CE 6.0 R3 board support packages (BSPs) for OMAP-L1x floating-point DSP+ARM9 processors, Sitara AM1x ARM9 microprocessor units (MPUs) and associated evaluation modules (EVMs). The new BSPs enable developers to easily and quickly interface devices to Embedded CE. The BSPs include drivers and source code. Windows Embedded CE 6.0 R3 BSPs for OMAP-L1x and AM1x devices can be downloaded now for free.

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