BSQUARE Corp. (Nasdaq:BSQR) is producing a production-quality board support package (BSP) for TI’s OMAP35x(tm) Evaluation Module (EVM). The OMAP35x application processors are based on the new ARM® Cortex(tm)-A8 processor, which offers an unprecedented combination of laptop-like performance and superior power management for a wide range of applications, including digital set-top boxes, mobile Internet appliances, portable navigation devices, media players, and personal medical equipment. Together, the EVM and BSQUARE’s BSP — the first Windows Embedded CE BSP to support the ARM Cortex-A8 processor — will give device designers everything they need to create next-generation Windows Embedded CE-powered devices using TI’s new OMAP35x application processors.
Until now, TI’s OMAP(tm) 3 processors were available only to mobile handset customers. With the introduction of the OMAP35x platform, TI is making its OMAP processors available to the broad market, allowing a wide range of original equipment manufacturers (OEMs) to create the most advanced embedded devices.
BSQUARE will be delivering its production-quality BSP and other technology and services for the OMAP35x platform this quarter. The BSP will be available from TI to developers who purchase the EVM. BSQUARE will also provide engineering services, quality assurance, and support for device designers to help them get their Windows Embedded CE-powered OMAP35x products to market in record time.
More info: BSQUARE
SYSGO recently announced a PikeOS Board Support Package for Kontron’s AM4100, an AdvancedMC (AMC) board using the MPC8641D dual-core processor based on the latest generation of Freescale’s E600 core. The PikeOS BSP has been developed to be used in a multi-application system for an avionics equipment to be certified to DO178B. The PikeOS port for Kontron’s AM4100 AMC board is available immediately. PikeOS also supports the three families x86, PowerPC and MIPS processors. The supported personalities are the PikeOS Native, ARINC-653, Linux, POSIX and OSEK, as well as personalities involving partners or third-parties like Java, Ada, µITRON, CoDeSys®, VxWorks® and FidelityVCF(tm).
PikeOS is an embedded systems platform where multiple virtual machines can run simultaneously in a secure environment. The secure virtualisation technology allows multiple OS APIs to run concurrently on one machine. Several personalities needed in avionics are available such as POSIX with TCP/IP, Java, and ARINC/APEX, including a full ARINC 653 scheduler. Using PikeOS personalities allows a clear separation of applications in different partitions, thus meeting the needs of a multi-application system with different levels of criticality, depending on each application. PikeOS has been ported to the MPC8641D processor on Kontron’s AM4100 that supports both asymmetric and symmetric multi-processing.
More info: SYSGO | Kontron
Adeneo recently announced the full commercial release of the Windows Embedded CE 6.0 BSP for NXP LPC3180 ARM9(tm) processor-based microcontroller. The BSP targets the phyCORE LPC3180 board, a standard development platform from PHYTEC. It supports all key features of the LPC3180, including optimized power management, and ARM® Vector Floating Point (VFP) library for CE 6.0. A free binary evaluation version is available for free, for testing and demonstration purpose. For OEMs willing to perform in depth evaluation and qualification of Adeneo BSP, a free 20 days evaluation of the source code is available under NDA. Adeneo provides also for commercial design the complete source code through an attractive one-time license, without royalties.
Mistral Solutions’ Accelerator Program for Windows(R) Embedded CE 6.0 is designed for use with Texas Instruments Incorporated’s (TI) DaVinci(TM) technology. The Accelerator Program for Windows Embedded CE 6.0 is a complete Software Development Kit (SDK) for TI’s TMS320DM6446 Digital Video Evaluation Module (DVEVM) based on DaVinci technology. Mistral’s BSP enables customers of DaVinci technology to prototype their software on the DVEVM board before implementing their products.
Adeneo is offering Microsoft Windows Embedded CE 6.0 BSPs for Atmel’s ARM9 based chips: AT91SAM9260, AT91SAM9261 and AT91SAM9263. The BSPs, fully compliant with Atmel’s EK development kits, implement most of the features of each chip, and are the key starting points for OEMs developing smart Windows Embedded CE based devices. Also, the coverage of the complete SAM926x family ensures OEM to have a solution for any type of device, from very low cost communication devices up to multimedia products requiring high graphical performance.
TI’s Software Development Kit (SDK) for Windows Embedded CE is designed for use with the TMS320DM6443 and TMS320DM6446 system-on-chip (SoC) processors based on DaVinci technology. The SDK will empower developers who prefer the Windows Embedded operating system to now easily access TI’s silicon and software for digital video applications. DaVinci technology and the Windows Embedded CE development environment are both popular choices for applications such as set-top boxes, digital media adapters, voice-over-IP (VoIP) phones, navigation systems and portable media players. TI’s offering for Windows Embedded CE offering is optimized for TI’s TMS320DM6443 and TMS320DM6446 SoC processors.
Digi International is offering a development kit with board support package (BSP) for Microsoft’s Windows Embedded CE 6.0 for ARM processors and integrated wireless networking. BSPs are now available for Digi’s ARM-based ConnectCore(TM) 9C and ConnectCore Wi-9C modules, with integrated wired and wireless networking support, as part of Digi’s new range of development kits – Digi JumpStart Kits(TM) (JSK).
The new Digi JSKs are designed to speed up the process of ARM-based embedded development with an emphasis on affordability and usability. Each Digi JSK includes all hardware, software and tools required to complete development of an embedded product including the module itself. The Digi JSK for Windows Embedded CE 6.0 also includes 180-day evaluation copies of Microsoft Visual Studio development system and Windows Embedded CE 6.0. The Digi JSKs are now available at an introductory price of $399.
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Freescale Semiconductor created a Windows Mobile 6 board support package (BSP) for the i.MX31 multimedia applications processor platform. One of the first applications processors based on the ARM11(TM) core to support the Windows Mobile 6 operating system (OS), Freescale’s BSP is designed to provide a simple and efficient migration path for original equipment manufacturers (OEMs) with devices running previous versions of Windows Mobile.
Xilinx’s lead-free, RoHS compliant ML410 development platform is based on the Virtex(TM)-4 FX60 FPGA. The ML410 provides designers with a high performance logic fabric, two embedded PowerPC(R) 405 processors and a considerable quantity of high-speed serial I/O with integrated transceivers. When paired with the Xilinx Embedded Development Kit (EDK) and extensive catalog of IP peripherals, the ML410 platform provides a comprehensive embedded development system that enables rapid prototyping and verification of embedded system designs.
Momentum Data Systems’ VCP1500/VCP1700 PCI Development boards are a new line of PCI based hardware platforms for the development of PNX1500 TriMedia/Nexperia Processor, including PNX0190 and PNX9520, or PNX1700 applications and algorithms where the PC is used at the I/O subsystem during development. The VCP1500 can also be used for TriMedia TSSA based algorithm development for PNX8950 platforms.
The VCP boards contain twice the memory of the LCP boards and integrates video output peripherals, whereas the LCP boards require daughtercards for video and audio output, but VCP has video and audio outputs integrated on-board.