Category Archives: BSP

board support packages

TI Windows Embedded CE 6.0 R3 BSP for OMAP-L1x, Sitara AM1x Processors

Texas Instruments rolled out Microsoft Windows Embedded CE 6.0 R3 board support packages (BSPs) for OMAP-L1x floating-point DSP+ARM9 processors, Sitara AM1x ARM9 microprocessor units (MPUs) and associated evaluation modules (EVMs). The new BSPs enable developers to easily and quickly interface devices to Embedded CE. The BSPs include drivers and source code. Windows Embedded CE 6.0 R3 BSPs for OMAP-L1x and AM1x devices can be downloaded now for free.

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Freescale i.MX51 Evaluation Kit for Android OS

The new Freescale i.MX51 evaluation kit (EVK) speeds and simplifies the development of compelling applications based on the Google Android platform and Freescale’s i.MX51 processor. The i.MX51 EVK is available now and ships with software BSPs on accompanying pre-flashed SD cards. In addition, Android OS BSP images for the i.MX51 processor can be downloaded from the Freescale website.

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Adeneo Embedded Windows Embedded CE 6.0 R3 BSPs

Adeneo Embedded released a complete set of Windows Embedded CE 6.0 R3 BSPs for various silicon vendors and platform architectures. Adeneo has migrated all of their BSPs to Windows Embedded CE 6.0 R3. The Adeneo engineering team worked closely with Microsoft in the development of complete solutions using Silverlight for Windows Embedded as well as Windows Embedded CE 6.0 R3. Thanks to Microsoft Silverlight technology included in Windows Embedded CE 6.0 R3, application and user experiences can be implemented quickly.

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Windows Embedded CE 6.0 Board Support Package for Freescale i.MX25 PDK

Adeneo Embedded rolled out the Windows Embedded CE 6.0 Board Support Package (BSP) for Freescale’s i.MX25 Product Development Kit (PDK). The BSP supports key features of the i.MX25 PDK. The i.MX25 PDK’s integrated modular design is engineered to enable a more efficient development process — a critical benefit for accelerating hardware and software integration. The PDK simplifies development with three separate, reusable modules that work together for streamlined software creation. The Windows Embedded CE 6.0 BSP supports a complete set of features for the i.MX25 PDK and combined with Adeneo Embedded’s BSP development capabilities, ensures OEMs the ability to quickly deliver smart, connected devices to market.

More info: Adeneo Embedded | Freescale i.MX25 Product Development Kit

Board Support Packages for QNX Neutrino RTOS 6.4

QNX Software Systems announced over 20 reference designs and development kits for industrial automation platforms with board support packages (BSPs). QNX BSPs are covered by the commercial-friendly Apache 2.0 license, which, unlike the restrictive GPL license, gives developers the option to keep their derivative source code private or to publish it for cooperative development. Developers can download the new QNX BSPs immediately.

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Adeneo Embedded Board Support Packages for Freescale i.MX27 PDK

Adeneo Embedded announced the Windows Embedded CE 6.0 R2 and Linux 2.6 Board Support Package (BSP) for Freescale’s i.MX27 Product Development Kit. The i.MX27 PDK’s integrated modular design is engineered to enable a more efficient development process – a critical benefit for accelerating hardware and software integration. The PDK simplifies development with three separate, reusable modules that work together for streamlined software creation.

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Adeneo Windows Embedded CE 6.0 BSP for NXP LPC3250 ARM9

Adeneo recently released the Windows Embedded CE 6.0 reference BSP for the NXP LPC3250 ARM9 processor-based microcontroller. The LPC3250 ARM based microcontroller features a 266 MHz ARM926EJ core, 256 KB SRAM, Vector Floating Point (VFP), 24-bit LCD Controller, 10/100 Ethernet MAC, On-The-Go USB, and a large set of standard peripherals offering embedded designers the ability to reduce on-chip components and maximize power savings without sacrificing performance. A binary evaluation version is available for free, for testing and demonstration purpose. For OEMs willing to perform in depth evaluation and qualification of Adeneo BSP, a free 20 day evaluation of the source code is also available. Adeneo provides for commercial design the complete source code through an one-time license that includes 90 days of free support and updates.

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PikeOS Board Support Package for Freescale MPC8379EMDS

SYSGO recently announced the PikeOS Board Support Package for Freescale MPC8379EMDS, a Modular Development System (MDS) board using the MPC8379e, a PowerQUICC® II Pro Communications Processor based on a high performance Power Architecture(tm) e300 core. PikeOS has been ported to the MPC8379e processor on Freescale’s MPC8379EMDS that provides high integration that simplifies board design and provides a cost effective solution for critical applications such as network attached storage.

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Adeneo Windows Embedded CE 6.0 BSP for NXP LH7A404 ARM9

Adeneo recently released the Windows Embedded CE 6.0 BSP for NXP Semiconductors LH7A404 ARM9 processor-based microcontroller. The BSP targets the LH7A404 development kit, a standard development platform from LogicPD. It supports all key features of the LH7A404, including display touchscreen, audio and USB drivers. Fully-featured to cover all customer applications – The BSPs includes the drivers for most of the peripherals integrated in LH7A404 chip, including USB, Display, Audio, Touchscreen. This allows for targeting of all types of custom solutions.

A binary evaluation version is available for free, for testing and demonstration purpose. For OEMs willing to perform in depth evaluation and qualification of Adeneo BSP, a free 20 day evaluation of the source code is available under NDA. Adeneo also provides for commercial design the complete source code through an attractive one-time license, without royalties. Free binary evaluation version of the BSP, and the NDA for 20 days access to source code, can be retrieved on Adeneo website.

Because of its compliance with Microsoft PQOAL (Production-Quality OEM Adaptation Layer) and PQD (Production Quality Device) specifications, Adeneo BSPs are a cost-effective way to develop custom solutions on NXP Chips under Windows Embedded CE with the minimal redesign. Only the portions of the BSPs handling board features need to be reviewed and redesigned and all code linked to the core CPU can be reused without modifications.

The LH7A404 ARM based microcontroller features high-resolution integrated LCD controllers and provides System-on-Chip capability for customers in consumer, entertainment, industrial, medical and automotive industries.

More info: Adeneo | NXP Semiconductors

BSQUARE DevKit OMAP35x and DevKit OMAP2530

BSQUARE Corp. (Nasdaq: BSQR) recently announced two new OMAP(tm) DevKit hardware development platforms to support TI’s OMAP35x(TM) and OMAP25x(TM) platform. The DevKit OMAP35x and DevKit OMAP2530 each include a production-ready Windows® Embedded CE 6.0 board support package (BSP), and is the only development platform available supporting OMAP(TM) processors running Windows CE. The development platform and BSP will help original equipment manufacturers (OEMs) build Windows Embedded CE-powered connected, multimedia, and embedded devices to reduce development costs and get their products to market faster. The BSQUARE DevKit OMAP2530 is available now, and the DevKit OMAP35x will be available later this quarter. Both products will include production-quality Windows CE 6.0 board support packages, technical support, and documentation.

BSQUARE will also offer a 3G version of the DevKit, with pre-integrated Sierra Wireless CDMA and GSM modules (via daughter card), for customers who want to build next-generation connected devices. This platform will drastically reduce development and verification time for these devices, enabling OEMs to bring advanced products to market much faster than they could before.

In addition, BSQUARE has ported the Adobe® Flash® Lite(tm) software to the OMAP35x DevKit. Adobe Flash Lite software is a powerful runtime engine for mobile and embedded devices that enables these devices to faithfully display Flash-enabled Web content. With Flash Lite 3, OEMs will be able to better differentiate their products, providing customers with improved Web browsing, video content, and compelling interactive experiences.

The DevKit OMAP35x is designed with a modular and extensible architecture to increase design flexibility. The DevKits include a separate CPU/PMIC module featuring a TI TWL4030 system-on-chip (SOC). The PMIC, specifically designed for the OMAP35x platform, supports power management, audio and other functions that previously required additional circuitry, enabling developers to reduce the footprint, cost and power consumption of their devices.

The DevKits also support a wide variety of peripheral hardware, including two SDIO/MMC memory card ports (one 4-bit and one 8-bit slot), a 10.4″ TFT LCD display, and expansion headers that can be used for a broad range of other I/O devices.

The physical layout of the DevKits, which includes a large number of easily accessible connection points, gives developers full access to hardware for quick testing and debugging. Additionally, as developers move from the prototype design stage to full-scale development efforts, the development team can use the DevKits to concurrently develop system software and applications, further accelerating time to market.

More info: BSQUARE | Texas Instruments