VIA Technologies introduced the AMOS-5001 Em-ITX chassis kit for fanless embedded systems. The VIA AMOS-5001 chassis kit makes it easy to create x86 embedded systems that can withstand a wide temperature range of -20°c to 55°c and are capable of sustaining a g-force of up to 50. The modular chassis consists of only four mechanical parts. The case is slim enough to fit in even the most space-constrained environment (35.2 mm high x 231 mm wide x 124.8 mm deep). The VIA AMOS-5001 chassis kit is available now.