The benefits of advanced thermal management solutions are significant. Thermal management for advanced military computing systems connects to performance, reliability and power consumption.
A typical heat transfer path for a conduction-cooled high performance computing solution consists of three main elements shown in the Figure:
GE Intelligent Platforms’ thermal ground plane (TGP) greatly enhances heat dissipation capability and supports more complex computing operation in a rugged environment. A collaboration of GE Global Research Center, Defense Advanced Research Projects Agent (DARPA), Air Force Research Laboratory, and the University of Cincinnati developed a TGP-based heat spreader technology that replaces aluminum- or copper-based heat frames and offers better than 2x the potential for heat dissipation and performance enhancement than is possible with current systems.
For more information about TGP technology, download the white paper.