Extreme Engineering Solutions Announces XPedite7450 COM Express Module

Extreme Engineering Solutions launched the XPedite7450 COM Express module. The X-ES XPedite7450 is based on the 3rd generation Intel Core i7 quad-core processor. The rugged board features up to 16 GB of DDR3-1333/DRR3-1600 ECC SDRAM, an integrated high-performance 3D graphics controller, enhanced Type 6 pinout, five Gen2 PCI Express ports, four USB 2.0 high-speed ports, six SATA 3.0 Gb/s ports, and an Intel High Definition Audio port. The XPedite7450 will be available in July 2012. It is ideal for harsh military, aerospace, and industrial environments.

The XPedite7450 complies with the PICMG COM Express Basic form factor (95mm x 125mm) and supports an enhanced Type 6 pinout. The XPedite7450 can be hosted on a standard COM Express carrier card or a custom carrier card built to include additional end-user requirements, or it can be integrated into an X-ES XPand6000 Small Form Factor (SFF) rugged system.

X-ES XPedite7450 Features

  • Supports 2nd generation Intel Core i7 processors and 3rd generation Intel Core i7 processors
  • Dual- or quad-core processor with Intel Hyper-Threading Technology
  • Standard COM Express Basic form factor with ruggedization enhancements
  • COM Express enhanced Type 6 pinout
  • Up to 16 GB of DDR3-1333 ECC SDRAM in two channels
  • 32 MB NOR boot flash
  • Up to 16 GB of NAND flash
  • Two x8 PCI Express ports
  • One x4 PCI Express port
  • Two x1 PCI Express ports
  • Two 10/100/1000BASE-T Gigabit Ethernet ports
  • Four USB 2.0 ports
  • Six SATA 3.0 Gb/s ports
  • Two digital display interfaces (DP/DVI/HDMI)
  • Intel High Definition Audio port
  • Linux BSP
  • Wind River VxWorks BSP
  • Microsoft Windows drivers
  • Incorporates the same design and manufacturing principles as all X-ES Level 5 rugged products
  • Designed and tested for operation from -40 to +85°C
  • Includes additional mounting holes for increased structural integrity
  • Provides extended shock and vibration capabilities for operation in harsh environments
  • Features conduction-cooled and air-cooled applications supported by a single design
  • Soldered-down memory replaces less rugged/reliable SO-DIMMs
  • Utilizes tin-lead manufacturing process to mitigate tin-whisker effects (RoHS-compliant process is also available)
  • Provides BIT support

More info: Extreme Engineering Solutions, Inc. (X-ES)