Extreme Engineering Solutions Unveils XPedite5550 COM Express Module

Extreme Engineering Solutions (X-ES) announced the XPedite5550 COM Express module. The XPedite5550 complies with the PICMG COM Express Compact form factor (95mm x 95mm) and supports an enhanced Type-5 pinout. The board can be hosted on a standard COM Express carrier card, hosted on a custom carrier card built to include any additional requirements from the end user, or integrated into the X-ES XPand6000 Series of Small Form Factor (SFF) rugged systems. The board features up to 8 GB of DDR3-800, x2 and x1 PCI Express interfaces, three Gigabit Ethernet ports, two SATA 3.0 Gb/s ports, two serial ports, and a USB 2.0 port. BSPs for Linux, INTEGRITY, and VxWorks are available. QNX, LynxOS, and other O/S support may be available as needed.

Extreme Engineering Solutions (X-ES) XPedite5550 COM Express module

The XPedite5550 can be hosted on a standard COM Express carrier card, hosted on a custom carrier card built to include any additional requirements from the end user, or integrated into the X-ES XPand6000 Series of Small Form Factor (SFF) rugged systems. The XPedite5550 includes enhancements above and beyond commercial COM Express modules to provide a rugged and reliable COTS processor mezzanine solution. It has been tested for the harshest military, aerospace, and industrial environments

The XPedite5550 was developed with the rugged XPand6000 SFF systems in mind. Supporting conduction cooling, natural convection cooling, and minimal SWaP, an XPand6000-based system can be bolted to almost any available surface of a small UAV or ground vehicle. Weighing as little as 3.5 lbs., XPand6000 systems provide both high-performance processing capabilities and a multitude of I/O functions added via PMCs/XMCs, including MIL-STD-1553, serial, router, and storage capability in an extremely small and lightweight package.

X-ES XPedite5550 Features

  • Freescale QorIQ P2010 and P2020 processors with dual PowerPC e500v2 cores at up to 1.2 GHz
  • Conduction-cooled and air-cooled applications supported by single design
  • Extended shock and vibration tolerance
  • Up to 8 GB of DDR3-800 ECC SDRAM
  • x2 PCI Express interface
  • x1 PCI Express interface
  • Three Gigabit Ethernet ports
  • Two Serial ports
  • USB 2.0 port
  • Up to 256 MB of NOR flash (with redundancy)
  • Up to 32 GB of NAND flash
  • Linux BSP
  • Wind River VxWorks BSP
  • QNX Neutrino BSP
  • Green Hills INTEGRITY BSP
  • Incorporates the same design and manufacturing principles as all X-ES Level-5 rugged products
  • Designed and tested for full operation from -40 to +85°C
  • Additional mounting holes for increased structural integrity
  • Soldered down memory replaces less rugged and less reliable SO-DIMMs
  • Tin-lead manufacturing process to mitigate tin-whisker effects (RoHS-compliant process is also available)
  • BIT support
X-ES XPedite5550 COM Express module block diagram

More info: Extreme Engineering Solutions, Inc. (X-ES)