TI Windows Embedded CE 6.0 R3 BSP for OMAP-L1x, Sitara AM1x Processors

Texas Instruments rolled out Microsoft Windows Embedded CE 6.0 R3 board support packages (BSPs) for OMAP-L1x floating-point DSP+ARM9 processors, Sitara AM1x ARM9 microprocessor units (MPUs) and associated evaluation modules (EVMs). The new BSPs enable developers to easily and quickly interface devices to Embedded CE. The BSPs include drivers and source code. Windows Embedded CE 6.0 R3 BSPs for OMAP-L1x and AM1x devices can be downloaded now for free.

The Windows Embedded CE BSPs include drivers and protocol stacks for many of the chips’ integrated peripherals, such as Ethernet, USB, CAN, SATA, LCD and touch screen controllers. Additionally for OMAP-L1x devices, the BSP provides access to TI’s TMS320C674x DSP using DSP/BIOS Link inter-processor communication software. DSP/BIOS Link enables developers to easily access the DSP for algorithm development using Windows Embedded CE 6.0 R3.

The OMAP-L1x and AM1x board support packages are compatible with the following TI processors and associated EVMs:

  • OMAP-L137 processor
  • OMAP-L138 processor
  • AM1707 microprocessor
  • AM1808 microprocessor
  • AM17x Evaluation Module
  • AM18x Evaluation Module
  • AM18x Experimenter’s Kit
  • OMAPL137/C6747 Floating Point Starter Kit
  • OMAP-L138/TMS320C6748 EVM
  • OMAP-L138 Experimenter Kit

More info: Texas Instruments Windows Embedded CE Software Development Kit