STMicroelectronics BAL-2593D5U, BAL-2690D3U ICs for Bluetooth Designs

The BAL-2593D5U and BAL-2690D3U ICs, from STMicroelectronics, enable designers to connect an antenna to a Bluetooth transceiver using a single chip. The BAL-2593D5U and BAL-2690D3U are integrated baluns, used to convert the antenna signal to a balanced pair of signals as required by the Bluetooth transceiver. The new devices occupy up to 70% less printed-circuit-board area, simplify design and assembly, and ensure better balanced signal channels with low losses. The BAL-2593D5U and BAL-2690D3U are in production now, in 4-bump flip-chip packages, priced at $0.25 for a minimum order of 5000 pieces.

STMicroelectronics BAL-2593D5U and BAL-2690D3U balun ICs

STMicroelectronics BAL-2593D5U Features

  • 50/50+j50 ohm impedance for 2.45 GHz ISM band
  • 1.16 x 1.26mm footprint
  • 1.2dB insertion loss
  • Matches STLC2592/3, STLC2500D
  • Low amplitude imbalance
  • Low phase imbalance
  • Very low profile (<700 µm)
  • High RF performances
  • RF component count and area reduced

STMicroelectronics BAL-2690D3U Features

  • 50 ohm nominal input, 30+j25 output differential impedance
  • 0.8dB insertion loss
  • Low amplitude imbalance
  • Low phase imbalance
  • Very low profile (<700 µm)
  • High RF performances
  • RF component count and area reduction
  • 0.91 x 0.91mm footprint; sub-0.7mm profile
  • Matches STLC2690

More info: STMicroelectronics