VIA EPIA-T700 Mobile-ITX Module

VIA Technologies introudced the EPIA-T700 Mobile-ITX module. The VIA EPIA-T700 computer-on-module is ideal for ultra-compact embedded devices in medical, military, and in-vehicle applications. The board is powered by a specially miniaturized, fanless 1GHz VIA Eden ULV processor and the compact VIA VX820 MSP. The VIA EPIA-T700 can be used with a variety of carrier boards that can be adapted and customized to meet the needs of a range of applications. The VIA EPIA-T700 Mobile-ITX module features 512MB of DDR2 on-board system memory.

VIA EPIA-T700 Mobile-ITX Module

VIA EPIA-T700 Mobile-ITX Module Features

  • Mobile-ITX form factor, the smallest existing COM, sized in 6 cm x 6 cm
  • Integrated VIA UniChrome Pro II 3D/2D AGP graphics with MPEG-2/4 and WMV9 video decoding acceleration
  • Onboard DDR2 512MB soldered memory chip
  • Supports one VGA and one TTL/DVP
  • Supports one 1-lane PCI Express
  • Supports one single-channel IDE hard drive
  • Supports five USB 2.0 ports
  • Supports HD audio

The VIA VX820 media system processor features the VIA Chrome9 DX9 integrated graphics core, the VIA Chromotion video engine with hardware acceleration of MPEG-2, MPEG-4, WMV9, and VC1video formats, and VIA Vinyl HD Audio supporting up to eight channels of HD audio.

An integrated multi-configuration transmitter enables display connection to TTL LCD panels and CRT monitors. Added flexibility is provided through carrier board configurations that integrate the DVP interface to include LVDS and DVI support. Other integrated data bus technologies include PCI Express and Ultra DMA.

The VIA EPIA-T700 uses two unique high density, low profile connectors on the under side of the module that can also withstand vibrations of up to 5Gs making Mobile-ITX systems suitable for in-vehicle and industrial machining applications.

More information: VIA Technologies