STMicroelectronics STA370BWS SoundTerminal Audio Chip

The STA370BWS SoundTerminal chip, from STMicroelectronics, features ST’s Full Flexible Amplifier (FFX) technology. The STA370BWS offers high-quality stereo audio at 10W and above, in various consumer applications, including the latest ultra-thin LED-backlit Flat TVs. The STA370BWS SoundTerminal chip is the first in a new generation of ST’s SoundTerminal portfolio. The portfolio currently includes the STA333BW, STA335BW, STA339BW, STA339BWS, and STA369BWS. The STA370BWS has a resale price of $2.50 for 10,000-piece orders. It is now sampling to lead customers.

STMicroelectronics STA370BWS SoundTerminal Audio Chip

STMicroelectronics STA370BWS SoundTerminal Features

  • Input and output channel mapping
  • Programmable zero-detect mute
  • Automatic invalid input-detect mute
  • Up to 8 user-programmable biquads/channel
  • Three coefficients banks for EQ presets storing with fast recall via I2C interface
  • Extended filter dynamics +4/-4 for better sound shaping and easier filter implementation
  • Bass/treble tones and de-emphasis control
  • Selectable high-pass filter for DC blocking
  • Advanced AM interference frequency switching and noise suppression modes
  • F3X advanced PWM modulation scheme for carrier suppression (headphone or line output)
  • Selectable high- or low-bandwidth noise-shaping topologies
  • 96-kHz internal processing sample rate with quantization error noise shaping for very low cut-off frequency filters
  • Full short-circuit protection at device power-up
  • Coefficient checksum with software reset capabilities

The STA370BWS is the first audio device to use the STMicroelectronics’ proprietary BCD8 process technology. The BCD8 process is the eighth generation of ST’s Bipolar/CMOS/DMOS technology, which allows the company to build analog, logic, and high-voltage functions on a single chip to increase performance and reduce cost. In developing the STA370BWS, ST has leveraged its BCD8 process to integrate more sophisticated audio signal processing within the CMOS section, enabling a better listening experience for end users. The device also performs a short-circuit check at power on, which increases application safety and prevents pc-board damage, leading to minimum rework costs for equipment manufacturers.

The device’s on-chip power amplifier also delivers better performance over conventional digital amplifiers, using ST’s FFX technology, which provides improved audio at the amplifier output. In addition, ST’s F3X technology, the third-generation of FFX amplifiers, used in the STA370BWS’s auxiliary output, further improves audio quality by suppressing non-audio signals, such as the carrier waveform that governs the amplifier’s timing, to produce clearer, purer sound throughout the output-power range.

Advanced chip manufacturing technologies govern the performance and cost of today’s digital audio chips, delivering advantages that include reduced noise and distortion, support for more sophisticated audio processing, and extra features integrated on the chip to reduce the total number of system components. In addition, each technology evolution delivers higher functionality per chip size than its predecessor, enabling extremely competitive pricing relative to performance.

More info: STMicroelectronics