VIA Mobile-ITX Open Form Factor Specification for Embedded Devices
VIA Technologies developed the Mobile-ITX open form factor specification for the creation of ultra-compact and portable embedded devices. Mobile-ITX defines a uniquely compact 6cm x 6cm computer-on-module specification designed to enable an easier and less resource intensive development cycle for a range of ultra-compact, portable embedded systems. The VIA Embedded Platform Division will announce the first commercial CPU module based on the Mobile-ITX form factor in Q1 2010.
Mobile-ITX at 6cm x 6cm, is currently the most compact computer-on-module form factor on the market — 50% smaller than the VIA-developed Pico-ITX form factor. Mobile-ITX employs a modularized design that includes a CPU module card and an I/O carrier board. This offers greater flexibility for developers who can easily drop in the CPU module to a custom designed, application specific carrier board, negating lengthy developmental design, and testing phases.
CPU modules based on the Mobile-ITX form factor integrate core CPU, chipset and memory functionality and I/O that includes the CRT, DVP and TTL display support, HD Audio, IDE, USB 2.0, as well as PCI Express, SMBus, GPIO, LPC, SDIO and PS2 signals, through customizable baseboards. Mobile-ITX-based modules consume as little as 5 watts, ideal for always-on, mission critical systems.
A range of advanced technologies can be implemented on a variety of Mobile-ITX compatible carrier board designs that can be adapted to suit almost any environment, or application specific criteria. The CPU module I/O signals are mapped to two unique high density, low profile connectors on the under side of the module, with a distance between the CPU module and the baseboard of only 3mm, making it ideal for ultra-slim system designs. The connectors can also withstand vibrations of up to 5Gs making Mobile-ITX systems suitable for in-vehicle and industrial machining applications.
Vertical market segments including medical, transportation, and military embedded markets have evolved to demand greater miniaturization and portability from today’s x86 platforms. Mobile-ITX addresses the need for a simple, modular approach to portable IPC design, making it easier than ever to bring to market ultra-compact and lightweight devices that offer comprehensive connectivity options and a rich, flexible feature set.
More info: VIA Technologies
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