Microchip High-Temperature Portfolio for AEC-Q100 Grade 0

Microchip Technology introduced a portfolio of semiconductors specified for operation up to 150° C ambient — including 8- and 16-bit PIC microcontrollers (MCUs) and dsPIC Digital Signal Controllers (DSCs), serial EEPROM devices, and analog products. Qualified and tested in accordance with AEC-Q100 Grade 0 requirements, the devices are optimum for under-the-hood automotive applications; extreme-environment industrial applications, such as down-hole oil drilling and lighting; and for medical applications such as devices that are sterilized in autoclaves. Engineers can now add intelligence directly into high-temperature applications, where the silicon can be mounted directly onto high-temperature assemblies.

Microchip Technology High-Temperature portfolio

Microchip High-Temperature Portfolio Highlights

  • 20 new 16-bit devices with industry-leading MCU performance, including
    • dsPIC33FJ motor-control and general-purpose devices with integrated digital signal processing, CAN connectivity and 12-bit Analog-to-Digital Converters (ADCs)
    • PIC24HJ general-purpose MCUs with CAN connectivity and 12-bit ADCs
  • High-performance PIC18F4680 8-bit MCU family with CAN connectivity and small footprint, including the PIC18F2585, PIC18F2680 and PIC18F4585 MCUs
  • Additional 8-bit PIC MCUs include the PIC16F616 and PIC18F1320 families; and the miniature, 8-pin PIC12F615 MCU
  • 25LC080C through 25LC256 SPI serial EEPROM device families, as well as the 24LC01B I2C serial EEPROM
  • MCP9700 low-power linear active thermistor

The ability to mount silicon directly onto high-temperature assemblies means that Brushless DC (BLDC) motors can be used in place of mechanical, belt-driven actuators for water pumps, engine cooling fans, turbocharger waste gates, and throttle-control applications. This improves fuel efficiency and reduces emissions by enabling intelligent use of more efficient, on-demand technology. Sensors can now be placed directly into automotive gearboxes, engine-coolant systems and oil reservoirs. MCUs featuring CAN and LIN connectivity enable small footprints and efficient bus connections. The elimination of heat shields and extra wiring saves cost and complexity for industrial and automotive applications. In addition, active electronics can be mounted onto sterile medical instruments and function during the autoclave sterilization process.

More info: Microchip Technology High-Temperature Design Center