MiniModule SIO Stackable Legacy I/O SUMIT Board for CoreModule 730 SBC

ADLINK Technology introduced the Ampro by ADLINK MiniModule SIO, which is a SUMIT I/O module designed for the CoreModule 730 to provide a PC/104 interface, legacy I/O ports (serial, parallel, floppy, and PS/2), and additional USB 2.0 ports. The MiniModule SIO also utilizes the Ampro by ADLINK Extreme Rugged design methodology to support an extended operating temperature range of -40 to +85°C. Samples of the MiniModule SIO are available now.

Ampro by ADLINK MiniModule SIO Stackable Legacy I/O SUMIT Board for the CoreModule 730 SBC

The MiniModule SIO is ruggedized stackable 90×96 mm ISM module which provides support for legacy I/O via the SUMIT interface. The MiniModule SIO provides four serial ports (two via DB-9 connectors supporting RS-232/422/485, and two via pin headers supporting RS-232), a parallel port and floppy pin header (shared), PS/2 mouse and keyboard pin headers, and two USB 2.0 ports. The MiniModule SIO also provides a stack-up PC/104 interface to further add PC/104 connectivity to the CoreModule 730.

The Ampro by ADLINK CoreModule 730 was developed as a highly legacy-free ruggedized single board computer, and was the first to combine the new SUMIT I/O interface on the ISM 90×96 mm form factor. The addition of the MiniModule SIO provides greater flexibility to systems based on the CoreModule 730 by expanding its I/O options to include PC/104 and legacy serial, parallel, floppy, and PS/2 interfaces.

More info: ADLINK Technology