IDT Debuts 32-lane, 8-port and 48-lane, 12-port PCI Express Gen2 Switches
IDT® (Integrated Device Technology, Inc.; NASDAQ: IDTI) announced two new PCI Express® (PCIe®) Gen2 switching solutions that extend the company’s product and technology leadership position. Optimized for computing and embedded applications, the new solutions are based on proven, robust IDT switching architecture and technology, and support multicast functionality for increased system resource utilization.
Microchip Unveils MCP9509, MCP9510 Programmable Temperature Switches
Microchip Technology Inc. announced the MCP9509 and MCP9510 (MCP9509/10) resistor-programmable, logic-output temperature switches. The low-power devices’ temperature-switch threshold can be programmed with a single external resistor, meaning designers can stock one device for measuring multiple temperature points by varying the external resistance value.
SYSGO, Interface Concept Team on Integrated Embedded Solutions
SYSGO announced a formal partnership agreement with Interface Concept, signaling new levels of productive collaboration between major European software and hardware suppliers of embedded systems. SYSGO is a leading supplier of software solutions for the world’s most demanding safety and security applications. Interface Concept is a leading designer, developer, and manufacturer of electronic embedded solutions.
Unified Profile for DoDAF/MODAF 1.0 Draft Specification on Fast Track
Artisan® Software Tools has announced that the Unified Profile for DoDAF/MODAF (UPDM) 1.0 draft specification has achieved a positive vote at the OMG to successfully clear the first hurdle in the OMG’s fast track standardization process.
Vector Fields Introduces Finite Element Hysteresis Solver
Vector Fields, a part of Cobham plc, has extended the accuracy of its Opera electromagnetic simulator for electrical machinery applications with a new finite-element hysteresis solver for soft magnetic materials. Believed to be unique, the new Hysteresis Solver provides designers of motors, generators and other electrical machinery with an accurate means of accounting for losses and predicting performance changes.
SMIC Announces First 45-nanometer Yield Lot
Semiconductor Manufacturing International Corporation (“SMIC”, NYSE: SMI and SEHK: 0981.HK) announced its first 45-nanometer yield lot, signifying a working 45nm process. This first silicon success comes less than one year after SMIC signed an agreement with International Business Machines (“IBM”) to license its low-power and high-performance bulk CMOS technologies in December 2007.
Synfora Announces Seminar for SoC, FPGA Developers
Synfora Inc. will conduct a seminar on the morning of Tuesday, December 9, 2008, to show SoC and FPGA developers of video IP how to reduce design and verification time while being able to explore alternative implementations that will let them decrease silicon area and power consumption.
Agilent to Present SystemVue at FPGA Summit
Agilent Technologies Inc. (NYSE:A) announced that the company will participate in two seminar sessions here at the inaugural FPGA Summit. The event focuses on the design and use of FPGAs (field-programmable gate arrays). FPGAs offer flexible, rapid deployment of very high performance communications physical layer (PHY) architectures, such as those found in Software-Defined Radios (SDR).
HyperSilicon, Tensilica Team on SoC Prototyping in China
Tensilica,® Inc. announced that HyperSilicon Co., Ltd, of Beijing, China, has become its newest SOC (system-on-chip) prototyping partner, supporting customers of both the Xtensa® customizable processors and the Diamond Standard processor cores in the growing China market. HyperSilicon has particular expertise in designing FPGA development boards, which are often used to test new chip designs before producing the chip in silicon.
Seiko Epson to Use Actel ProASIC3 FPGAs for P-7000, P-6000 Photo Viewers
(Nasdaq: ACTL) announced that Seiko Epson Corporation has selected Actel’s ProASIC(R)3 FPGAs for use in its new Epson Multimedia Storage Viewer P-7000 and P-6000. Chosen for its low-power, reduced space, and high-performance advantages, the 125,000-system gate A3P125 ProASIC3 device is being deployed for high-speed access interface circuit to a CompactFlash card.