The TMS320C6474 multicore DSP from Texas Instruments Incorporated (TI) (NYSE: TXN) integrates three of TI’s TMS320C64x+ cores running at 1 GHz each on a single die, delivering 3 GHz of raw DSP performance that consumes 1/3 less power at 2/3 less DSP cost over discrete processing solutions. The C6474 provides significant system integration for customers currently utilizing DSP farms for communications infrastructure, medical imaging, military communications, and industrial vision inspection end equipments and markets. The TMX320C6474 is priced at USD $261 in 100u. The device is packaged in a 23 x 23 mm, 561 BGA package. A future C647x high performance multicore processor will include six cores and will be announced in first quarter 2009.
TMS320C6474 DSP Features
- Serializer/deserializer (SERDES) interfaces
- SGMII Ethernet MAC (EMAC)
- Antennae Interface (AIF)
- Serial Rapid I/O (SRIO)
- 32-kB of both L1 program and L1 data memory per core
- 3 MB of total L2 memory available in two configurations
- TI’s fastest DDR2 memory interface running at 667 MHz on the chip
In addition to the very high performance offered by the device, design teams with existing multi-chip system solutions can immediately reap the cost, power and space benefits of the C6474 because it is 100 percent code compatible with TI’s single core DSPs based on the C64x+ core (e.g. TMS320C6452, TMS320C6455), as well as those based on the predecessor TMS320C64x core, such as TMS320C641x devices. The C6474 achieves this system integration due in part to a process shrink to 65nm feature size, which means the C6474 can be packaged in a 23 mm x 23 mm ball grid array (BGA) and is comparable in size to TI’s existing single core DSP solutions fabricated in 90 nm technology.
The C6474 includes TI’s SmartReflex technologies, which leverage TI’s deep sub-micron process geometries to significantly reduce chip-level current leakage. The technologies incorporate a broad range of intelligent and adaptive hardware and software features that dynamically control voltage, frequency and power based on device activity, modes of operation, and process and temperature variation.