Lanner Announces VM-8016 All-in-One Video Motherboard
Lanner Electronics, Inc. announced the release of the world’s first 16-channel integrated H.264 video motherboard for Video over IP applications. The Lanner VM-8016 all-in-one video encoding motherboard simultaneously captures and encodes 16 channels of analog video to H.264 compressed digital format directly on the motherboard without external capture cards.
Kontron Rolls Out KISS 1U PCI-760 Ultra-slim 1U Industrial Server
The Kontron Industrial Silent Server (KISS) family has a new, high-performance member that brings the density and processing power of data processing centers to industrial applications: the Kontron KISS 1U PCI-760 with Intel quad-core processors is one of the most compact, robust, quietest and fastest high-availability industrial servers for densely packed long-lifecycle applications.
Enea Offers Training Classes on DO-178B, DO-254
Enea (Nordic Exchange/Small Cap/ENEA) announced that it will offer a DO-178B/DO-254 training course on November 13 – 14, 2008 at the Marriott Phoenix Buttes Resort. The course targets engineers and engineering managers who want to improve their knowledge and enhance their effectiveness applying and obtaining certification for safety-critical hardware and software processes covered by DO-254/DO-178B.
INSIDE Contactless Opens MicroPass Platform to Developer Community
INSIDE Contactless announced it is opening up its award-winning MicroPass® platform to the developer community, and providing sample MicroPass cards, development tools and technical support to advance the creation of innovative new contactless data applications. The new MicroPass 4001 and 5001 application-ready contactless microprocessors and INSIDE’s software development kit (SDK) tools give developers all they need to create and deploy a variety of standards-based contactless applications.
Tower, Jazz Semiconductor Announce Technology Conferences
Tower Semiconductor, Ltd. (NASDAQ:TSEM)(TASE:TSEM) and Jazz Semiconductor, Inc. announced they will host a series of global technology conferences in North America, Europe and Asia. The conferences will focus on presenting Analog-Intensive Mixed-Signal (AIMS) process technologies and design enablement capabilities offered by the companies for the production of advanced integrated circuits (ICs).
Wi-Fi Chipset Revenue to Approach $3 Billion in 2008
Over the last several years, the market for Wi-Fi chipsets (primary components, not including power amplifiers, LNAs and other external components) has grown from just over $1 billion in 2006, though just over $2 billion in 2007, and is expected to deliver revenue of nearly $3 billion in 2008. On the device side this is driven mainly by cellular handsets, consumer electronics, laptops, netbooks and MIDs. The laptop market already has 100% attach rates, so much of the growth will come in the other device categories.
Fab Owners Association Opens Group Purchasing to All Members
The Fab Owners Association (FOA), the international non-profit association for semiconductor device manufacturers and suppliers, has opened its group purchasing contracts to all of its members. Until now, group purchasing has been available only to its device maker members through FOA’s affiliate organization, FOA Purchasing Partners, Inc. (PPI). This announcement gives all members equal access to the 18 preferred vendor agreements negotiated over the past year-and-a-half by PPI.
DuPont Teijin Films Joins Systems-in-Foil Program of Holst Centre
DuPont Teijin Films, the world’s leading differentiated producer of PET and PEN polyester films, joins the Systems-in-Foil program of Holst Centre, a research initiative of the Flemish and Dutch research centers IMEC and TNO. By getting a major substrate vendor on board, Holst Centre gathers the entire ecosystem of industrial players around its Systems-in-Foil program line.