ADLINK Rolls Out Ampro CoreModule 430 Single Board Computer
ADLINK Technology Inc. (TAIEX:6166) announces the release of the Ampro by ADLINK CoreModule® 430 single board computer (SBC) to continue its commitment to the PC/104 market. The second new Ampro[tm] by ADLINK product since merging with Ampro, the CoreModule 430 proves that the venerable PC/104 ISA bus is still viable for years to come. The CoreModule 430 combines a wealth of legacy I/O interfaces with on-board video, DDR2 RAM, USB 2.0 and 10/100 Ethernet on a single 90×96mm module.
STMicroelectronics Introduces ST32, ST33 Smart Card Processors
STMicroelectronics (NYSE: STM) has introduced two new product families for cellular-phone SIM cards. The features enabled by the two new families will allow mobile network operators to enhance differentiation and expand revenue growth by delivering richer services to subscribers. The ST32 and ST33 smart card processor families use the best-in-class ARM Cortex-M3 32-bit processor architecture, and its SC300 secure version, combined with large embedded-Flash memory capacities.
ADLINK Announces Ampro RuffSystem 840 Extreme Rugged System
ADLINK Technology Inc. (TAIEX:6166) announced availability of the industry’s first Extreme Rugged[tm] system based on the Intel® Core[tm]2 Duo processor and GME965 chipset. The Ampro[tm] by ADLINK RuffSystem[tm] 840 integrates dual-core processor, RAM, graphics, networking, and PCI Express expansion in an Extreme Rugged enclosure that operates from -40 to +75 degrees Celsius.
IDC Forecasts Double Digit Growth for Wireless LAN Semiconductor
The worldwide wireless LAN (WLAN) semiconductor market is expected to pass the $4 billion mark by 2012 with a compound annual growth rate (CAGR) of 22.8%. While PCs will remain the largest application segment for WLAN semiconductors, mobile phone applications will grow at a CAGR of 49.3% and become the second-largest category for WLAN semiconductor revenue by 2012. IDC expects the MIMO-enhanced 802.11n technology to be the next growth driver for this market.
Gleichmann Electronics Announces NEC 21.3-inch Color LCD Display
NEC LCD Technologies’ 21.3-inch color LCD module, part number NL160120AC27-22B, which is ideally suited for use in medical applications, immediately broadens the product portfolio of Gleichmann Electronics. The display with ultra-extended graphics array (UXGA) enables a resolution of up to 1600 x 1200 pixels. The combination of proprietary ultra-advanced, super-fine TFT (UA-SFT) technology and a high-intensity direct backlight system thereby achieves a high luminance of 900 cd/m2.
Holst Centre Welcomes Solvay to Research Program
The international chemical and pharmaceutical group Solvay signs an agreement to become part of the research network of Holst Centre, an open-innovation initiative by IMEC (Belgium) and TNO (The Netherlands). Flexible organic electronics – or systems-in-foil – will in the future be driven by an industry producing, laminating and combining a variety of smart foils.