Mercury Offers Details on PowerBlock 50 Real-time Computing System
Mercury Computer Systems, Inc. (NASDAQ: MRCY), a leading provider of embedded, high-performance computing systems and software for complex image, sensor, and signal processing applications, released configuration and performance details regarding the PowerBlock[tm] 50 real-time computing system. The PowerBlock 50 establishes a new class of rugged embedded computing capability, putting processing power next to the sensor in space-constrained platforms such as unmanned vehicles.
Freescale Offers Synkro Protocol RF Network Protocol to CE Manufacturers
Freescale Semiconductor is now offering its radio frequency (RF) entertainment control network protocol, Synkro, to all consumer electronics manufacturers. Freescale’s Synkro protocol addresses the technology limitations and interruptions common to current infrared (IR) solutions.
Evatronix Offers Application Debugging Support for 8051, 68000 Cores
The Silicon Intellectual Property (IP) provider, Evatronix SA, announced the availability of the newest version of the Evatronix Application-debugging Support Environment (EASE) for two famous architectures – 8051 and 68000. The unique combination of software and hardware features allows testing the user’s application implemented directly in the target processor, thus eliminating the need for software simulations and shortening overall time-to-market.
IMEC Sets Record for Micromachined Piezoelectric Energy Harvesters
IMEC achieved a new record for micromachined piezoelectric energy harvesters, now delivering an output power of 60µW. The harvester can be realized with a simple, low-cost CMOS-compatible production process by using aluminum nitride (AlN) as piezoelectric material. The low resonance frequency of only 500Hz makes the device widely applicable. The output power of 60µW is sufficient to drive simple wireless sensors that intermittently transfer sensor readings to a master.
IMEC Develops Architecture for Flexible Forward Error Correction
IMEC has developed an innovative architecture for flexible forward error correction (FEC). The solution targets data transmission applications that need to combine flexibility, high throughput, and low power consumption. Examples are future wireless terminals and optical storage. IMEC’s FEC enables, on one processor, the turbo- and LDPC decoding of major communication standards. The technology is available for the industry either through a soft IP transfer, or through joint R&D projects.
HDIC, SMIC Team on HD2812, HD2910 High Definition Transmission Chips
Semiconductor Manufacturing International Corporation (“SMIC”; NYSE: SMI; SEHK: 0981.HK), and Shanghai High-Definition IC Co., Ltd. (HDIC) recently cooperated on SMIC’s 0.13um process to manufacture demodulator chips based on China’s terrestrial digital TV standard. HDIC’s high-definition series of chips, HD2812 and HD2910, were widely used by major TV set-top box manufacturers during the 2008 Olympic Games.
IMEC Makes Progress on 3D Stacked Integrated Circuits
IMEC, Europe’s leading independent nanoelectronics research institute announced that it has made significant progress with its 3D-SIC (3D stacked IC) technology. IMEC recently demonstrated the first functional 3D integrated circuits obtained by die-to-die stacking using 5µm Cu through-silicon vias (TSV). It will now further develop 3D SIC chips on 200mm and 300mm wafers, integrating test circuits from partners participating in its 3D integration research program.
Toshiba Selects Flexible Processor Technology from IMEC
IMEC announced that Toshiba, world-leading integrated device manufacturer, has licensed IMEC technology for designing power-efficient, flexible processors in a single- and multiprocessor architecture. The agreement concerns IMEC’s ADRES reconfigurable processor template, the DRESC compiler, and the MPSoC (multi-processor system-on-chip) suite of design tools. Toshiba will also cooperate with IMEC to develop processors and tools that enable gigabit/s demodulation.