Renesas Technology Introduces R8C/Lx Series Microcontrollers
Renesas Technology America, Inc. announced a new generation of microcontrollers (MCUs) with an on-board LCD controller. The R8C/Lx Series is the latest addition to the Renesas R8C Family of MCUs, which incorporates the powerful 16-bit R8C CPU core. The new devices integrate a number of advanced features such as a data transfer controller (DTC) and data flash memory with a background operation (BGO) function, which are already available in many R8C devices today.
IDT Introduces Gen2 PCI Express System Interconnect Switches
IDT[tm] (Integrated Device Technology, Inc.; NASDAQ: IDTI) announced a new series of PCI Express® (PCIe®) system interconnect switches that provide higher levels of performance, availability and optimal resource utilization in demanding enterprise applications. The switches are the first in the industry to support multicast and multi-root partitioning. IDT is further enabling the adoption of PCIe as the primary system interconnect for enterprise computing and communications applications.
Renesas Rolls Out SH77721 SH-NaviJ Series SoC for Car Navigation
Renesas Technology America, Inc. announced the SH77721 SoC (System-on-Chip) device. It’s the first product in the new SH-NaviJ series, a new SuperH® processor that is tailored for low-end through middle-range car information terminals, especially small portable navigation units and dashboard-mounted car navigation systems. The SH77721 builds on the technology that Renesas has developed in producing the popular SH-Navi series of processors now being used in many high-end designs.
e-con Systems Announces eSOM270 PXA270 COM Base Board
e-con Systems Inc., an embedded Product Development partner, and Chennai announced the release of the base board for it’s PXA270 system on module eSOM270. The base board has two USB host ports, one USB client port, one SDIO interface, 3 serial ports, camera interface, LCD and touch screen. The display can be a 3.5″ (QVGA) or a 5.7″ one. Along with the base board, detailed schematics, hardware user manual and the bill of material (BOM) will be provided to help the customers design their custom board faster.
Renesas, On Track Innovations Team on Contactless Payment Solution
Renesas Technology Corp. and On Track Innovations Ltd (OTI) (NASDAQ:OTIV) announced that they have developed a secure contactless microcontroller solution geared toward the US contactless payments market. The new secure payment solution has been certified by MasterCard PayPass for their 3.3 specifications and Visa 2.0.2 A&C V3.0 specifications to comply with contactless card standards. The solution is available to US banks and banks around the world who issue industry standard contactless cards.
Actel FPGAs Enable Miniaturization, Portability in Medical Equipment
Actel Corporation (Nasdaq: ACTL) announced that its mixed-signal Fusion and low-power IGLOO and ProASIC3 families are enabling designers of medical equipment to stay ahead of the growing trends toward miniaturization and portability. The ultra low-power, high-reliability, integration, small footprint and enhanced security advantages of Actel’s flash-based FPGAs make them attractive for intelligent system and power management and various interface, display, communication and storage controls, as well as microcontroller functions.
Olympus-SoC Place-and-Route System Features Parallelism Technology
Mentor Graphics Corporation (Nasdaq: MENT) announced the immediate availability of new task-oriented parallelism technology in the Mentor Graphics Olympus-SoC[tm] place-and-route system that allows timing analysis and optimization tasks to run in parallel to deliver up to 7X improvement in timing analysis run times and up to 4X improvement in design closure times using eight CPU cores.
Renesas Developers Conference 2008
Renesas Technology opened the doors to Renesas Developers’ Conference (DevCon), a must-see event for embedded design engineers using or evaluating Renesas microcontrollers (MCUs) and microprocessors (MPUs). Renesas DevCon is the company’s first large-scale technical conference of its kind in the U.S., and is expected to draw more than 250 design engineers from North and South Americas.