ADLINK Launches Ampro Extreme Rugged ETX 620 Computer on Module
ADLINK Technology Inc. (TAIEX:6166) announces the release of the ETX® 620 as part of an initiative to extend its Extreme Rugged[tm] product lines. The first new Ampro[tm] by ADLINK product since the Ampro acquisition was completed, ETX 620 brings the proven design methodology of the high-end ETX 802 to harsh environments where lower processing performance is required. The ETX 620 computer-on-module (COM) is a no-compromise design for mission-critical military, avionics, medical, and industrial applications.
Adeneo, Atmel Offer Windows Embedded CE 6.0 Training Session
Adeneo announced with Atmel a Windows Embedded CE 6.0 Training Session in Dallas, TX. This event is the perfect opportunity for OEMs willing to start a Windows Embedded CE on a powerful platform like Atmel ARM9 based on AT91SAM9 architecture. The goal of this training is to provide an in depth understanding of all Windows Embedded CE internal mechanisms, and to teach all technical information needed to start using Win CE for OEM designs.
MSC Vertriebs Reveals EXM32 System on Module Specification
MSC Vertriebs GmbH has disclosed the EXM32 system-on-module (SOM) specification, which was developed in-house by MSC. The EXM32 SOM specification offers interested companies the possibility to design and market EXM32-based products. The goal is to make the already widely spread standard available to an even larger circle of users and manufacturers. For this purpose, an EXM32 consortium was recently formed.
National Instruments Integrates NI Multisim 10.1, LabVIEW
National Instruments announced further integration of the NI Multisim and LabVIEW platforms. By integrating the recently released Multisim 10.1 and LabVIEW, engineers can better identify and analyze design behavior and detect errors at the earliest stages of design. Additionally, with the beta version of the NI LabVIEW Multisim Connectivity Toolkit, engineers now can enhance circuit design.
In-Stat Publishes Research on Wi-Fi in Consumer Electronics
Because of its large installed base in mobile PCs and home networks, flexibility, and mature ecosystem, Wi-Fi is a valued, “Swiss army knife” technology for the consumer electronic (CE) market reports In-Stat. According to research from the high-tech market research firm, digital TV will be the second largest category of CE stationary devices shipping with Wi-Fi.
MSC, Hitachi Debut TX20D19 WVGA TFT Display Module with LED Backlight
MSC UK & Hitachi Europe Ltd, Display Products Group (DPG) has announced the introduction of a new compact 8.0″ wide aspect ratio TFT display module. The new TX20D19 supports a 15:9 wide aspect ratio, a display resolution of 800 x 480 pixels (WVGA) and delivers excellent optical performance. The new transmissive display continues Hitachi’s implementation of rugged, reliable and high brightness LED backlighting in medium size TFT display modules.
Altatech Launches AltaCVD Chemical Vapor, Atomic Layer Deposition Tool
Altatech Semiconductor announced the launch of AltaCVD®, an advanced materials CVD (Chemical vapor deposition) and ALD (Atomic layer deposition) tool. Based on Altatech’s breakthrough vaporizing technology enabling the deposition from new, viscous and non-volatiles precursors, AltaCVD® offers unique new capabilities to R&D facilities and pilot productions lines.
MOST Interconnectivity Conference Asia to Take Place in Seoul
The MOST Cooperation – the organization through which the leading automotive multimedia network Media Oriented Systems Transport (MOST) is standardized – will host the 9th MOST Interconnectivity Conference Asia on November 5th, 2008. Representatives of the MOST Cooperation will present to Asian carmakers and their suppliers an update on recent achievements of the organization and the MOST standardization roadmap. The Conference is open to the public.