Android Phone Features Open Kernel Labs Embedded Hypervisor
Open Kernel Labs (OK Labs) announced that the company’s OKL4 embedded hypervisor is employed on the Qualcomm chipset inside the market’s first-ever commercial Android-powered handset. Manufactured by HTC Corp., the Dream phone or G1 introduced by T-Mobile in September 2008 is the first handset powered by the Android software platform developed by Google and the Open Handset Alliance. At the heart of the G1 is the Qualcomm MSM7201A, a dual-core ARM family device with hardware-accelerated multimedia, 3D graphics and integrated multi-mode 3G baseband processing.
Enfora, Motorola Partner on WiMAX Wireless Platforms
Enfora announced their WiMAX wireless platform, based on Motorola’s WMP1000 technology, and targeted to the growing demand for WiMAX enabled devices within vertical markets such as automotive, healthcare and energy for WiMAX connected solutions. Bringing together key hardware and software elements from its industry leading portfolio of wireless solutions, Enfora’s WiMAX platform provides the capability to build intelligent connectivity directly at the edge of the network.
ARM Connected Community Welcomes RadiSys
RadiSys® Corporation (NASDAQ: RSYS), a leading global provider of advanced embedded solutions, announced that it has joined the ARM® Connected Community, the industry’s largest ecosystem of ARM technology-based products and services. As part of the ARM Connected Community, RadiSys will gain access to a full range of resources to help it market and deploy innovative solutions that will enable developers to get their ARM Powered® products to market faster.
Emerson Network Power Centellis 4620 Passes CP-TA Cooling Tests
Emerson Network Power announced that the Centellis[TM] 4620 is the industry’s first 16-slot AdvancedTCA® (ATCA®) platform to pass the rigorous Communications Platform Trade Association (CP-TA) B.4 level, the CP-TA’s highest level of thermal performance.
Premier Farnell Ready for $100,000 Live EDGE Competition Entries
Premier Farnell plc (LSE:pfl) and its companies (Farnell, Newark, Premier Electronics, Farnell-Newark CPC, and MCM) announced that design entries are now being accepted for the international design competition, Live EDGE – Electronic Design for the Global Environment. The competition invites electronic design engineers, students and hobbyists to design products utilizing electronic components, which will positively impact the environment.
DSM Somos Announces TetraShell Hollow build Software for Prototyping
DSM Somos® has announced that it will introduce a new software application allowing SL users to create light-weight prototypes having enhanced structural integrity. Based on patented technology from the Milwaukee School of Engineering (MSOE), TetraShell[tm] hollow build software will use MSOE’s TetraLattice technology to facilitate the manufacture of hollow stereolithography parts with variable skin thicknesses, supported by a patented and proprietary TetraLattice[tm] support structure.
Gleichmann Announces NEC NL6448BC18-01, NL6448BC18-01F TFT LCD Modules
NEC LCD Technologies’ 5.7-inch TFT LCD modules, NL6448BC18-01 and NL6448BC18-01F, consume approximately 50 percent less power compared to displays with cold-cathode fluorescent lamp (CCFL) backlight systems. These TFT LCD modules will – in the future – enhance the product portfolio of Gleichmann Electronics. By using a backlight system – based on highly luminescent white LEDs – an additional inverter circuit is not necessary.
embWiSe Ports Linux SDIOWorx to Freescale’s iMX31, iMX27 Platforms
embWiSe Technologies Pvt.Ltd. had announced support for its Linux SDIOWorx package on Freescale Semiconductors’ iMX31 and iMX27 Host Processor platforms. Riding on the success of its complete Linux SDIOWorx package, embWiSe had developed and ported its Linux version of SDIOWorx package on Freescale’s iMX31 and iMX27 Processor Platforms under Linux 2.6.x kernels. The iMX31 and iMX27 application processors from Freescale Semiconductors are targeted for multimedia applications.