News 2008.09.18 Late Edition
Tanner EVI Integrates with Mentor Calibre Verification Suite
Tanner EDA announced the immediate availability of its External Verification Interface (EVI) product, available with Tanner Tools v13.11 release on Windows®. EVI provides a seamless interface for Tanner customers using Mentor Graphics’ Calibre® tool suite to verify their designs. Used in conjunction with Calibre RVE, customers can review Calibre DRC errors, LVS results, and PEX parasitics in L-Edit and S-Edit environments.
Corelis Rolls Out ScanExpress Boundary-Scan Tool Suite 6.6
Corelis Inc. announced that Corelis has just released the latest version of its powerful ScanExpress Boundary-Scan Tool Suite. The new Version 6.6 now combines ScanExpress JET with the uniquely expanded capabilities of both ScanExpress TPG test development and ScanExpress Runner test execution software. These developments represent a quantum leap in automatic circuit board testing.
Freescale Announces 2009 FTF Design Challenge
Registration for the Freescale Technology Forum (FTF) Design Challenge Americas is now open online. The design paper deadline is Dec. 19, 2008. With the FTF Design Challenge, Freescale invites the engineering community to find creative ways to use less energy, limit the environmental impact of existing products and create new products that help to improve the environment. Participants will create their designs using solutions from the company’s broad product portfolio.
MatrikonOPC to Discuss OPC Unified Architecture at 2008 User Group
MatrikonOPC[tm] will be hosting the only European OPC User Group on October 22, 2008 in Barcelona Spain. The MatrikonOPC User Group will teach attendees how to optimize, implement and integrate OPC Solutions that will automate their process control systems and instantly improve productivity and communications for their company. Attendees will explore the future of OPC technology in the new OPC Unified Architecture specification presented by an industry expert from the OPC Foundation.
Imbera Develops Next Generation Integrated Module Board Technology
Imbera Electronics announces the launch of its next generation integrated module board (IMB) technology, available across Imbera’s full range of turnkey manufacturing services. IMB technology allows OEMs/ODMs to produce smaller boards, quickly and in a cost-effective manner by making simple adaptations to existing manufacturing processes. The advanced packing solution already has considerable momentum, with early customer-wins including a contract with Ibiden.
Control-See Adopts MatrikonOPC Technology for Data Connectivity
Control-See, a leader in alarm notification software, has chosen to standardize on MatrikonOPC[tm] technology for all of its data connectivity needs. “To receive secure and reliable alarm notification data, we chose MatrikonOPC as our data connectivity provider because of their reputation as the industry standard for providing reliable critical data,” said Michael Meirovitz, CEO of Control-See.
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