Microchip Introduces PICDEM Touch Sense 2 Board with mTouch Sensing
Microchip Technology Inc., a leading provider of microcontroller and analog semiconductors, announced an addition to its mTouch[tm] capacitive touch offerings, the PICDEM[tm] Touch Sense 2 Demo Board (Part # DM164128). The easy-to-use board comes with the updated, royalty-free mTouch[tm] Sensing Solution Software Development Kit (SDK) and is populated with a 16-bit PIC24FJ256GB110 microcontroller (MCU), which features an integrated Charge Time Measurement Unit (CTMU) peripheral for fast capacitive touch sensing.
Skyworks, Ember Team on ZigBee Front-End Modules
Skyworks Solutions, Inc. (NASDAQ: SWKS) and Ember announced that they are partnering to develop the industry’s first portfolio of ZigBee front-end modules (FEM) targeting applications such as smart meters in energy management, home area networks (HAN), and industrial automation. ZigBee is a wireless network standard that solves the unique needs of remote monitoring and control, and sensor-network applications.
Phase Matrix Announces PXI RF/MW Down Converter Module Family
Phase Matrix, Inc. announced the product introduction of their family of PXI RF/microwave (RF/MW) down converter modules, which were developed in support of a Small Business Innovative Research (SBIR) program sponsored by the Navy (Navair PMA 260D). The complete module set will be demonstrated this week at Autotestcon 2008 in Salt Lake City. The module family consists of five (5) PXI (3U) modules that can be configured into any one of six (6) primary configurations.
Cadence Unveils Encounter Power System for Power Integrity, Signoff
Cadence Design Systems, Inc. (NASDAQ: CDNS) announced Cadence® Encounter® Power System, a next-generation power integrity and analysis solution for digital implementation and signoff. Building upon the Si2 Common Power Format (CPF) at the core of the Cadence Low-Power Solution, Encounter Power System provides a unified interface and database for timing, signal integrity, power analysis and diagnostics, enabling correct-by-construction optimization and signoff across these domains.
Jazz Semiconductor Announces PDK for Cadence Virtuoso IC 6.1
Jazz Semiconductor® (AMEX:JAZ) announced availability of the Jazz IC 6.1 process design kit (PDK) for Cadence Design Systems’ Virtuoso® IC 6.1 custom design platform in Jazz’s 0.18-micron SiGe BiCMOS process (SBC18). The collaboration between Jazz and Cadence on integrated radio frequency/mixed-signal (RF/MS) platforms reduces time-to-market for AIMS products.
Ambric Launches Rapid Media Processing Platform
Ambric® announced its new Ambric Rapid Media Processing[tm] (RMP[tm]) platform, a comprehensive collection of five elements: the Am2000[tm] family of Massively Parallel Processing Array (MPPA) devices; the aDesigner[tm] tool suite and libraries; the Am2045[tm] GT[tm] family of reference boards; a rich set of codec IP content; and the OpenVIS compliance specification which enables interoperability of codecs under a common host application and hardware platform.
Cadence Improves Early Dynamic Power Analysis, Pre-RTL Exploration
Cadence Design Systems, Inc. (NASDAQ: CDNS) has extended its low-power leadership with breakthrough technologies for system-level power analysis and exploration. Having established the Cadence® Low-Power Solution as the leader in design, implementation and verification systems for advanced low-power chips, Cadence now addresses designers’ next critical need – faster power exploration and estimation – earlier in the product design lifecycle.
Wipro Technologies Becomes Member of Power Forward Initiative
Power Forward Initiative (PFI) announced that Wipro Technologies has recently joined the initiative and is offering Common Power Format (CPF)-enabled low-power design capabilities to its design services customers worldwide. The PFI membership has now grown to over 30 companies around the world, representing a broad spectrum of semiconductor, IP, EDA, ASIC, design services and manufacturing providers.