News 2008.08.27

MSC Vertriebs Announces CXC-GS45 COM Express Type 2 Modules
Highest computing power in the compact COM Express[tm]-Format 95 x 95 mm fully compliant to the COM Express[tm] Type 2 specification – these are the highlights of the new module family CXC-GS45 offered by the MSC Vertriebs GmbH. The platform is based on the recently announced devices in small form factor (SFF) from Intel’s Embedded Low Power Roadmap. In conjunction with single-core and dual-core processors built in 45nm technology, the Intel® GS45 Graphics and Memory Controller Hub (GMCH) and the enhanced Intel® I/O Controller Hub (ICH9-M) have been implemented.

Kontron Rolls Out ETXexpress-PC COM Express Computer-on-Module
Equipped with space- and energy-saving 45nm high-end processors, the new Kontron ETXexpress®-PC COM Express[tm] Computer-on-Module sets new performance-per-watt standards for embedded applications with high demands on data processing and/or multi-media conversion and output. Based around the also recently introduced high performance and low-power 45nm Intel® Core[tm] 2 Duo processor SP9300 and Intel® GS45 chipset, this very robust COM Express[tm] module excels over the previous 65nm dual core processor offerings.

OPC Training Institute to Discuss Unified Architecture Specification
The OPC Training Institute (OPCTI), an independent training organization, is scheduled, on September 16, 2008, to address the impact of the OPC Foundation’s OPC Unified Architecture (UA) specification on the worldwide manufacturing industry. The OPC UA specification was first proposed in 2004, however it is only in 2008 when OPC integrators have seen products available with the UA wrapper.

Design and Verification Conference Issues Call for Papers
The 2009 Design and Verification Conference (DVCon), sponsored by Accellera, is now accepting paper, panel and tutorial submissions. Proposals that reflect real experiences using hardware design and verification languages, advanced tools and methodologies are encouraged. Paper and panel proposals are due September 19, 2008.

Arrow, Exor/Sitek Develop EasyLCD System Image Processing Solution
Lattice Semiconductor Corporation (NASDAQ: LSCC) announced that Arrow Electronics has developed and released an advanced FPGA-based video and imaging solution, the EasyLCD System. This system meets the image processing speed and quality standards required by the automotive, marine, consumer, building automation and industrial control markets. EasyLCD System was developed by Arrow’s European reference board team and design partner Exor/Sitek International.

ZTE Selects Tundra PCI Express Product for Platform Graphics Card
Tundra Semiconductor Corporation (TSX:TUN) has been selected by ZTE Corporation to supply Tundra’s high performance PCI Express® product for ZTE’s Next Generation Platform System Graphics Card. ZTE selected Tundra’s high performance semiconductor to improve overall performance on its new Graphics Card. Tundra’s high performance semiconductor has typical power consumption of 1.3W, and incorporates power management to minimize power consumption during operation.