Micron Introduces 32GB e-MMC Embedded Devices
Micron Technology, Inc. (NYSE:MU) announced their latest e-MMC[tm] embedded devices. At 32GB, they are the highest densities available on the market today and are fully compliant with MMC standards. In addition, these newest e-MMC devices from Micron take advantage of the company’s industry-leading 34nm MLC NAND process technology, and feature an extended temperature range (-40C to +85C) for automotive and industrial applications.
Samsung Optimizes Embedded Memory Solutions for Smart Phones
Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology, announced that it is introducing software designed to optimize the high performance features of its proprietary embedded flash memories: OneNAND[tm], Flex-OneNAND[tm] and moviNAND[tm], in smart phones, using the major mobile operating systems – Windows Mobile(CE), Symbian, Linux, and RTOS (real-time operating system).
Synopsys Announces Silicon-Proven DDR3, DDR2 IP Solutions for SoC
Synopsys, Inc. (NASDAQ: SNPS) announced the availability of a full range of silicon-proven DesignWare® DDR IP solutions for systems-on-chips (SoCs) that require an interface to high-performance DDR3, DDR2 and DDR memory subsystems. The DesignWare DDR IP solutions deliver memory system performance of up to 1600 Mbps, the maximum data-rate of the JEDEC DDR3 specification. The solutions include configurable protocol and memory controllers, integrated mixed-signal PHYs including I/Os and verification IP.
ABI Research Offers Evolution of Mobile Devices Market Webcast
Mobile devices are the biggest-selling consumer electronics products in the world, with more than one billion shipping every year. However, the market is in a state of rapid flux. “Three or four years from now, no mobile device vendor – no matter what their market position today – will be in a ‘comfort zone’,” says ABI Research vice president and research director Stuart Carlaw, in a new webcast available on the firm’s website.
Robotics Trends Announces RoboDevelopment Academic Outreach Program
Robotics Trends announced the RoboDevelopment Conference & Exposition Academic Outreach Program, which provides colleges and universities with free Exhibit Hall Passes and discounted Conference Pass registrations for students, educators and researchers, as well as complimentary exhibit space for select universities. RoboDevelopment, the international technical design and development event for personal, service and mobile robotics industry, will be held November 18-19, 2008.
Vishay Rolls Out 0603 Case Size Automotive Thin Film Chip Resistor
Vishay Intertechnology, Inc. (NYSE: VSH) announced the release of the industry’s first professional automotive thin film chip resistor in the 0603 case size to combine a high operating temperature to +175°C (1000 hours) and an advanced level of rated power. While most thin film chip resistors offer power ratings to 100mW at +70°C ambient temperature, the power rating of the MCT 0603 AT is specified to 150mW at +85°C.