News 2008.08.06 Late Edition
NI Annonces sbRIO-96xx Single-Board RIO Devices for Embedded System
National Instruments announced new NI Single-Board RIO devices that offer engineers and scientists a low-cost, integrated hardware option for deploying embedded control and data acquisition applications. The eight new sbRIO-96xx devices combine an embedded real-time processor, reconfigurable field-programmable gate array (FPGA) and analog and digital I/O on a single printed circuit board (PCB), making them ideal for applications that require flexibility, high performance and reliability in a small form factor.
Airgain Launches Profile Embedded PCB Antenna Products
Airgain, Inc., a smart-antenna innovator improving wireless connectivity in next-generation wireless gateways, routers and media systems, introduces its new line of Profile high-gain embedded PCB antennas for Wi-Fi devices. Based on Airgain’s patented multi-element, directional antenna technology, the Profile series comes in single and dual band designs ideally suited for embedded applications requiring integration flexibility and low cost.
MOST Cooperation Reveals Automotive Infotainment Specification 3.0
The MOST Cooperation, the organization through which the leading automotive multimedia network Media Oriented Systems Transport (MOST) is standardized, has created MOST Specification Rev. 3.0 for the next generation infotainment backbone. It is a complete overhaul of the specification structure offering several new features. While the specification is independent of speed grade, it can already work with the newly defined MOST150 physical layer.
Open Verification Methodology World Community Forms Advisory Group
The Open Verification Methodology (OVM) World community announced the OVM Advisory Group (OAG), an organization of distinguished users and ecosystem suppliers, is helping to develop new features and capabilities for the OVM. Founding members of the OAG include ARM; Cisco Systems, Inc.; Denali Software, Inc.; Freescale Semiconductor, Inc.; IBM Corp.; Infineon Technologies; Nokia Corp.; STMicroelectronics NV and Xilinx, Inc.
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