AXIOMTEK Introduces eBOX639-822-FL Fanless Embedded System
AXIOMTEK unveils the eBOX639-822-FL, a fanless application-ready embedded system with unique anti-vibration mechanism design (1Grms with HDD), excellent thermal solution (-10°C ~ 50°C with Intel® Pentium® M 2.0GHz and wide-temperature HDD), and optimized expandability. The eBOX639-822-FL is designed with powerful Intel® 910GMLE and ICH6-M chipset and supports Intel based processors in ether BGA or PGA packaging.
IBASE ECX810 ECX Single Board Computer with Intel EP80579 Processor
IBASE Technology, a leading supplier of embedded boards and systems, reveals the IBASE ECX SBC – ECX810, based on the latest Intel® EP80579 processor (Tolapai). The new Intel® architecture processor in ECX810 is a full featured embedded x86 SoC combines numerous powerful enabling technology on a single chip. This new SoC is based on the Intel® Pentium® M processor, integrated memory controller hub, and a variety of integrated communications and embedded I/O controllers.
MOST Forum 2008 Reveals Conference Program
The MOST Forum announces the conference program for the international conference and exhibition on September 30, 2008, in the Liederhalle Cultural and Congress Center in Stuttgart (Germany) covering a broad field of topics with a wide range information on MOST® infotainment technology. During their presentations the speakers will discuss MOST applications, experiences and technologies concerning networking and system architecture, physical layer, compliance and quality aspects, series projects experience, MOST and other standards as well as MOST in research and development.
Round Solutions Creates WLAN Module for Wireless Machine Control
More and more highly sophisticated devices – from the CNC turning lathe to the coffeemaker – can send and receive data via TCP/IP and thus over the Internet. So far, however, a hardwired communications path realised with Ethernet was usually necessary to achieve such an exchange. This often led to quite complicated and thus expensive line installations. Round Solutions now presents a solution on the basis of WLAN.
AXIOMTEK Debuts eBOX832-831, eBOX832-840 Systems with Intel Core 2 Duo
AXIOMTEK, an Associate Member of the Intel® Embedded and Communications Alliance (ECA), is pleased to introduce two compact yet high performance embedded computers, the eBOX832-831 and eBOX832-840, which feature flexible selections of processing power and offer superior graphics via a PCI Express x16 slot. With the extremely rugged aluminum housing only 300 x 210 x 104.5 mm (11.8″ x 8.27″ x4.11″) in size, these compact-size rugged industrial systems can be applied in the most of harsh environments.
ip.access Publishes Paper on Home Femtocells
Home femtocells are allowing mobile operators to deliver a personal 3G signal that will unleash the full potential of the latest phones, according to a new briefing paper from leading femtocell developer ip.access. The combination of excellent voice quality, higher data speeds, longer battery life, plus simple connectivity and lower costs means that femtocells are now set to enable the very best user experience – positioning 3G phones to become the hub of in-home entertainment and internet connectivity.
VMETRO Announces New Storage Alternatives for VMDRIVE
VMETRO announced the availability of additional new storage alternatives for its VMDRIVE. Available since January 2007, the VMDRIVE 6U VME/cPCI slot storage products now include rotating media options as well as several larger capacity solid-state storage options. Designed to meet demanding military and aerospace applications, the VMDRIVE enables deployment of recording applications in rugged conduction-cooled or commercial air-cooled environments.
Renesas Rolls Out RJK0383DPA Dual-type Power MOSFET
Renesas Technology America, Inc. announced the RJK0383DPA, a dual-type power MOSFET that enables smaller, higher-efficiency synchronous-rectification DC/DC converters for generating various supply voltages in communication devices and laptop PCs. The advanced, tenth-generation device integrates high-side and low-side power MOSFETs and a Schottky barrier diode in a compact (5.3×6.2×0.8mm, max) package with high thermal conductivity.