Cambridge Consultants XAP5 Core Sets New Standard for 16-Bit Processors
Cambridge Consultants has launched its next generation XAP processor core – XAP5 – offering wireless and sensor chip designers an advanced level of 16-bit processing performance combined with low energy consumption and efficient use of low cost memory, making it ideally suited for cost-sensitive high-volume products. XAP5 combines the economy of a 16-bit data word with a 24-bit address space for large programs up to 16 Mbytes.
Intel Sells UHF RFID Reader Chip Operation to Impinj
Leading UHF Gen 2 radio frequency identification (RFID) solutions provider Impinj, Inc. announced the acquisition of Intel Corporation’s RFID operation, a business created by Intel’s New Business Initiatives (NBI) incubator and which developed the award-winning R1000 RFID reader chip. Financial terms of the acquisition are not being disclosed.
LitePoint Introduces IQnxnplus, IQultra, IQnav for MIMO, WiMedia, GPS
LitePoint Corporation launched three new systems for testing four wireless standards at a press conference. The new IQnxnplus system offers true multi-stream signal capabilities for WiFi and WiMAX MIMO development. IQultra – the industry’s first Ultra-Wideband (UWB) EVM test system – covers both development and manufacturing testing of UWB devices. And, the new IQnav test system is aimed at high-volume manufacturing testing of the proliferating, embedded, GPS-equipped devices.
Vishay Rolls Out White Power SMD LEDs in CLCC-2 Flat Ceramic Package
Vishay Intertechnology, Inc. (NYSE: VSH) released the industry’s first series of high-intensity white power SMD LEDs in the CLCC-2 flat ceramic package. The robust and light-efficient VLMW82xx devices offer low thermal resistance of 20K/W and high optical power from 9000mcd to 18000mcd for thermal-sensitive applications. The CLCC-2 flat ceramic package of the VLMW82xx LEDs allows the additional current drive for a maximum light output while maintaining a high service life of up to 50,000 hours.
3M Creates 2mm Latch, Eject Headers for Wire-to-Board Applications
3M now offers a 2mm by 2mm latch/eject header for wire-to-board connections. The compact header offers a durable, flexible solution for applications where circuit board space is a concern. The 3M 2mm latch/eject header provides a robust system solution when mated with 3M IDC 1522 series sockets and 3M 2mm moulded assemblies series.
Envis Becomes Member of Si2 Low-Power Coalition
Silicon Integration Initiative (Si2) announced that Envis Corporation has joined Si2′s Low Power Coalition (LPC), an open industry group focused on advancing low-power design flow capability through open standards. The LPC owns and maintains the Common Power Format (CPF), an Si2 standard. The addition of Envis Corporation raises the total number of corporate members to 17.
VMETRO Debuts VPX-ENC-0102 VPX/VXS Portable Tower Enclosure, Backplane
VMETRO announced a five slot VPX/VXS portable tower enclosure and backplane to accelerate and simplify VPX system integration and development. The VMETRO VPX/VXS portable tower gives engineers and software developers a head start on their integration and application development. The backplane’s design enables full exploitation of the massive backplane bandwidth of VMETRO’s FPE650 quad-FPGA and HPE640 hybrid-PowerPC/FPGA VPX boards.
Xilinx to Attend IEEE Nuclear and Space Radiation Effects Conference
Xilinx, Inc. (Nasdaq: XLNX) announced that its industry-leading programmable logic solutions for enabling space applications, will be showcased at the 2008 IEEE Nuclear and Space Radiation Effects Conference (NSREC), July 14-18, 2008 in Tucson, Arizona. Xilinx in-booth demonstration and technology presentations are available for show registered attendees throughout the conference.