GE Fanuc Unveils V7812 6U VMEbus SBC with Intel Quad-Core LV Xeon
GE Fanuc Intelligent Platforms announced the immediate availability of the V7812 dual slot single board computer (SBC), responding to customer needs for significantly increased on-board bandwidth and advanced graphics capabilities in 6U VMEbus environments. The new SBC utilizes the latest Intel chipset delivering the unmatched performance and flexibility customers demand.
Kontron Announces ETX 3.0 ETX-CN8 Computer on Module with VIA CN896
Kontron’s ETX® 3.0 conforming ETX®-CN8 Computer-on-Modules with the VIA C7® (1.5 GHz) or VIA Eden[tm] processors (500 MHz) are now available with the Windows Vista®-ready VIA CN896 chipset. The new Kontron ETX® 3.0 Computer-on-Module impresses with its low-power consumption design without compromising on excellent 3D graphics performance in addition to planned long-term availability.
iWOW Announces TR-900 GSM/GPRS Wireless Connectivity Module
iWOW Connections announced the introduction of TR-900 GSM/GPRS module, a new member of the iWOW Wireless Connectivity Module family. TR-900 is designed with industry-leading performance, unrivalled upgradeability and a robust platform for easy development of customized applications. TR-900 utilized Texas Instruments LoCosto[tm] platform.
Samsung Introduces S3C2450, S3C2416 Application Processors for PNDs
Samsung Electronics Co., Ltd. announced the S3C2450 and the S3C2416, the newest members of its highly successful S3C24xx family of application processors. Designed and manufactured using 65nm process technology, the latest additions to Samsung’s suite of application processors are built on an ARM9 core with speeds of up to 533MHz.
Digi Debuts IEEE 802.15.4 Wireless Gateways, Adapters, Development Kits
Digi International (NASDAQ:DGII) introduced new versions of ConnectPort X gateways, XBee adapters and development kits that are compatible with its existing XBee and XBee-PRO 802.15.4 embedded RF modules. Together these products allow customers to wirelessly enable distributed groups of electronic devices and connect those devices to the Internet where they can be monitored remotely.
NI Rolls Out DIAdem 11.0 for Test Data Management, Visualization
National Instruments (Nasdaq:NATI) announced the release of DIAdem 11.0, the latest version of the interactive software for managing, analyzing and reporting test data. DIAdem 11.0 adds sensor data mapping for 3D CAD models to simplify the visualization of high-channel-count systems. It also streamlines large-group test management with automatic conversion and scaling of engineering unit sets.
Evatronix Develops ISA-compliant C80186XL, C6502 Soft IP Cores
Evatronix SA has announced its newest products: C80186XL and C6502 soft IP cores. They aim at original chip replacement applications and therefore significant effort was undertaken to achieve the degree of reliability that guarantees trouble-free porting of the existing software to FPGA or ASIC based core implementations.
Sarnoff Debuts Ultra-Sense Back-Thinning for Image Sensor Fabrication
Sarnoff Corporation introduced Ultra-Sense[tm], a complete wafer processing solution that reduces the manufacturing costs of high-performance back-illuminated image sensors. Ultra-Sense is an innovative solution that combines patented Silicon-on-Insulator (SOI) wafer technology with low-cost, scalable fabrication techniques to provide manufacturable back-illuminated image sensors.
Frost & Sullivan Offers Briefing on Mobile Devices, Ultra Wideband
The Technical Insights practice at Frost & Sullivan is pleased to announce its 2008 Quarterly Analyst Briefing Presentation on the North American mobile device market, to be held on Thursday, July 10, 2008 at 8:00 a.m. PDT. The burgeoning rise in interaction among various mobile devices and the rapid increase in memory capacity of these devices have created a need for wireless technology that is capable of facilitating high speed data transfers between mobile devices while consuming very little power.
Nexus Chips Leverages eASIC Nextreme Zero Mask-Charge ASIC
eASIC Corporation announced that Nexus Chips, a leading Korean provider of graphics acceleration solutions, has leveraged eASIC’s Nextreme zero mask-charge ASIC in its latest 3D graphics acceleration system. By using Nextreme, Nexus Chips was able to obtain twice the performance while reducing power consumption by 80% compared to the FPGA that was previously being used.
Triductor Selects Tensilica Diamond Standard 212GP Processor Core
Tensilica®, Inc. announced that Triductor Technology, of Santa Clara, CA, and Suzhou, China, has signed a second license for the Diamond Standard 212GP general-purpose processor core and has completed a second design tape out. Triductor has used the Diamond 212GP processor as the system controller for VDSL2 design for both the customer premise (CPE) and central office (CO) designs.