TRW Automotive Creates Scalable Airbag Electronic Control Units
The TRW Automotive Holdings Corp. (NYSE: TRW) subsidiary, TRW Automotive U.S. LLC, has developed a scalable airbag control unit (ACU) designed for the growing low-cost vehicle markets. The intelligent solution allows the ACU to be adapted within a platform to offer two options – standard and enhanced – for models sold within emerging territories and for those exported to developed markets.
VIA Technologies Rolls Out EPIA M700 Mini-ITX Board
VIA Technologies, Inc announced the VIA EPIA M700 Mini-ITX board, the first to feature the VIA VX800 chipset, for sophisticated digital signage and retail display systems. The VIA EPIA M700 addresses the increasing demands for enhanced media playback and visual clarity across multiple displays in digital multimedia applications with support for dual-DVI or DVI plus HDMI configurations with unique resolutions, pixel depths and refresh rates.
OKI Creates ML673520A Automotive Audio System LSI
Oki Electric Industry Co., Ltd. (TOKYO:6703) announced it has developed the “ML673520A” system LSI for automotive systems. The chip increases speed of compressing and recording digital audios by ten-fold and includes a function to playback three tunes simultaneously. The LSI is suitable for car audio systems and AV-integrated car navigation systems compatible with digital audio. The LSI includes a RISC CPU and an audio DSP as well as various communication functions.
ASOCS Launches MP100 Wireless MultiComm Processor
ASOCS, the developer of solutions for handheld devices, announced the launch of the MP100, the world’s first wireless MultiComms processor capable of running up to three wireless air interfaces concurrently. Customers using ASOCS’ single-chip MultiComm processor can reduce the bill of materials (BOM) by up to 50% and reduce power consumption by as much as 70%, whilst supporting wireless standards such as GSM/EDGE/GPRS, WiFi, HD Mobile Digital TV, and GPS.
Willcom Selects Wavesat Odyssey 8500 4G Chipset for XG-PHS Broadband
Willcom and Wavesat announced a special arrangement to cooperate on XG-PHS technology with the goal to accelerate the development, adoption and deployment of XG-PHS based Broadband Wireless solutions in Japan. The collaboration between the two companies will leverage Wavesat’s revolutionary multimode Odyssey 8500 4G chipset, providing access to multiple broadband wireless technologies including XG-PHS, WiMAX Wave2, WiFi and seamless migration to LTE.
Tektronix Develops First Methods of Implementation for UWB WiMedia 1.2
Tektronix, Inc., a leading worldwide provider of test, measurement and monitoring instrumentation, announced it had created the world’s first Methods of Implementation (MOI) for the new Ultra-Wideband (UWB) WiMedia PHY Test Specification Version 1.2 and released a new version of UWB Analysis software for DSA/DPO70000 series oscilloscopes that provides additional measurements for UWB WiMedia 1.2.
e-Shuttle Offers Electron-Beam Direct Write Technology for 65nm ICs
e-Shuttle, Inc., the company established by Fujitsu Microelectronics Limited and Advantest Corporation to provide prototyping services for leading-edge, large-scale ICs, is now delivering 65nm CMOS logic ICs manufactured using Electron-Beam Direct Write (EBDW) technology, the first full-scale application of EBDW techniques for complex logic ICs.
Design Automation Conference Features DACTube
The 45th Design Automation Conference (DAC) Web site includes a new, interactive feature this year. DAC attendees can preview speaker topics and pose questions to panelists via the popular video site YouTube and link them to the “DACTube” section of the DAC Web site. The 45th DAC will take place June 8 – 13, 2008 at the Anaheim Convention Center in Anaheim, Calif.