News – 2008.05.20 Late Edition

VDC Releases Latest Merchant ATCA CPU Blade Shipment Forecast
VDC has released the 2008 edition of its research on Slot Single Board Computers in Volume 1 of VDC’s Merchant Computer Boards for Embedded/Real-Time Applications Intelligence Program, 2008. The base year data for 2007 from this research indicates that the actual 2007 dollar volume shipments of ATCA CPU blades exceeded VDC’s previous forecast for 2007, which was published in 2006 based on year 2005 data.

Kineto Wireless, Agilent Team on 3G, 2G UMA/GAN Handset Testing
Kineto Wireless, the key innovator and leading supplier of UMA technology, and Agilent Technologies Inc. (NYSE: A) announced the companies are collaborating on 3G and 2G UMA/GAN handset testing to bring a comprehensive solution to their customers. The companies will focus on expanding Agilent’s 8960 “real world” UMA/GAN test capabilities to provide a full-featured, non-scripting test solution for mobile operators, handset vendors and platform developers in the UMA/GAN market.

OKI Releases Fingerprint Authentication LSI SDK v2 for ML67Q5250
Oki Electric Industry Co., Ltd. (TOKYO:6703) announced it has released its second version Software Development Kit (SDK) for ML67Q5250, the fingerprint authentication LSI that enables match-on-device. OKI made improvements to the SDK to enable compatibility with different types of touch sensors. In addition to slide sensors, manufacturers can now provide embedded systems for touch sensors that feature low power consumption and high-speed processing.

Apache Unveils Sentinel-PI Chip Package System Co-Design, Co-Analysis
Apache Design Solutions, the technology leader in power, noise, and reliability (PNR) signoff for chip, IC package, and system designs, announced Sentinel-PI, the industry’s first fully-integrated chip-package-system co-design and co-analysis solution for power integrity. Sentinel-PI provides SoC-aware modeling and analysis of the system-level power delivery network to enable IC package and PCB designers to optimize their designs, from early stage prototyping to system signoff.

MIPS Hi-Fi Audio Codec IP Achieves Lowest Power Consumption
MIPS Technologies, Inc. (NasdaqGS: MIPS), a leading provider of industry-standard architectures, processors and analog IP for digital consumer, home networking, wireless, communications and business applications, announced that its Hi-Fi Audio Codec IP platform has achieved the world’s lowest known power consumption for Hi-Fi audio playback, while reaching superior performance of 100dB dynamic range.

PureDepth to Present Multi-Layer Display Paper at SID 2008
PureDepth, Inc. (OTC: PDEP), a global leader in next-generation display technologies and the pioneer of Multi-Layer Display (MLD[TM]) technology, announced that Gareth Bell, Chief Scientist, will be presenting at the Society for Information Display (SID) Symposium on May 21, 2008 at 10 a.m. PDT. PureDepth’s MLD technology lends itself to a broad array of applications and the company is actively developing several of these.

Advanced Thermal Solutions to Present Temperature Measurement Webinar
Advanced Thermal Solutions, Inc’s popular Thermal Management Webinar Series continues in May with an hour-long technical webinar, “Temperature Measurement in Electronics Design”, on Wednesday, May 28, 2008 from 2:00-3:00 p.m. Participants will learn about the importance of measuring temperature in an electronic system, the instruments that are needed and the essential locations within a system which engineers should measure.

SemiSouth Laboratories to Present Normally-off SiC VJFET Paper at ISPSD
SemiSouth Laboratories Inc., a silicon carbide (SiC) based semiconductor company, will discuss the characteristics and specifications of their normally-off SiC JFET for 800V and 1200V power switching applications. SiC-based power semiconductors provide several advantages over their silicon-based counterparts. As a wide bandgap, unipolar device, the normally-off SiC JFET is an ideal candidate for use in high power switching applications.

ZMD to Showcase ADCs, Signal Conditioning Devices at Sensors Expo
ZMD AG, a global supplier of analog and mixed-signal integrated circuits for demanding environments, will showcase analog-to-digital converters and signal conditioning devices at the Sensors Expo ( on June 9 – 11. ZMD’s booth number is 820 at the Rosemont, Illinois, event. Attendees can evaluate the following devices for automotive, consumer, industrial and mobile medical applications:

Design Automation Conference Features ACM Turing Award Winners
The 2007 ACM Turing Award Winners, Dr. Edmund M. Clarke of Carnegie Mellon University; Dr. E. Allen Emerson of the University of Texas, Austin and Dr. Joseph Sifakis of Verimag Labs, France will be guest speakers at DAC. These accomplished researchers have been recognized with the highest honor in the area of computing for their role in developing Model-Checking into a highly effective verification technology, widely adopted in the hardware and software industries.