Jennic Creates LoWPAN Networking Stack for Embedded IP Communications
Jennic announces the industry’s first networking stack to enable a single-chip implementation for next-generation low-power wireless IP in embedded devices. By extending the widely understood IP protocol into the low power wireless domain, applications may leverage existing IP infrastructure and knowledge base, reducing development costs and time to market.
NEC Develops Technology for Complex, Non Rectangular TFT LCD Modules
NEC LCD Technologies announced the successful development of a manufacturing technology that enables more flexible design of thin-film transistor (TFT) liquid crystal display (LCD) panels. The prototype design, a “heart-shaped,” low-temperature polysilicon (LTPS) color TFT LCD module formed using two half-circular arcs and two straight lines, has a display width of 4.0 centimeters (cm), height of 3.6 cm and pixel pitch of 174 micrometers (146 pixels per inch).
Texas Instruments Rolls Out TNETC4820 Puma 5 DOCSIS 3.0 Chipset
Texas Instruments Incorporated (TI) [NYSE: TXN] announced a new DOCSIS 3.0® (Data Over Cable Service Interface Specification) product that supports cable set-top-boxes (STB) with both MPEG-TS (transport stream) and Internet Protocol (IP) capabilities. This latest addition to the Puma 5 family provides equipment manufacturers with the ability to create a new breed of hybrid STB products.
International Rectifier Unveils MOSFETs for Power Supplies, Electric Motors
International Rectifier, IR® (NYSE: IRF), a world leader in power management technology, introduced a new family of 60 V and 75 V MOSFETs optimized for industrial battery applications such as E-bikes, scooters and utility carts. The new N-channel devices utilize IR’s trench MOSFET technology with superior on-state resistance (RDS(on)) for improved system efficiency and high reliability.
Texas Instruments Announces TPS65136 Organic LED Power Driver
Driving advancements to power new display technologies, Texas Instruments Incorporated (TI) (NYSE: TXN) introduced an organic light emitting diode (OLED) power driver designed to enhance image quality for small form factor displays up to 2.5 inches. The TPS65136 power integrated circuit supports active matrix OLED (AMOLED) displays used in mobile phones, digital cameras and portable media players.
Infineon DECT 6.0 / CAT-iq Chipset Features TI Puma 5 DOCSIS 3.0 Cable Modem
Infineon Technologies AG (FWB:IFX) (NYSE:IFX) announced a cost-effective DECT solution, which when combined with a DOCSIS 3.0 chipset, produces a platform for North American cable service providers to deploy next-generation Voice-over-IP (VoIP) services operating over DECT 6.0 cordless telephones. The resulting platform combines Infineon’s COSIC[tm]-Modem and DUSLIC[tm]-xT with Texas Instruments’ (NYSE:TXN) PUMA-5 chipset.
Shanghai Welltech Automation Selects Ramtron FM25L16 Serial F-RAM
Ramtron International Corporation (Nasdaq: RMTR), a leading developer and supplier of nonvolatile ferroelectric random access memory (F-RAM) and integrated semiconductor products, has announced that China’s Shanghai Welltech Automation Co., Ltd., a leading pressure transmitter and magnetic flow meter supplier, has designed Ramtron’s FM25L16 16-kilobit (Kb) serial F-RAM memory device into its 2000S safe pressure transmitters.
Cypress, UICO to Create Electronic UI for Appliance, Medical, Industrial
Cypress Semiconductor Corp. (Cypress) (NYSE:CY), a global leader in high-performance, mixed-signal, programmable semiconductor solutions, announced a joint marketing agreement with UICO, LLC (UICO) enabling UICO to deliver innovative electronic user-interface (UI) solutions to the appliance, medical, and industrial markets. These UIs will be based on Cypress’s PSoC® mixed-signal arrays, including the industry leading CapSense[tm] capacitive touch sensing technology.
Sicap, Red Bend to Provide Seamless Management of Mobile Devices
Mobile operators and device manufacturers will now have complete control over remotely managing all mobile devices in the network using a standards-based, fully interoperable solution from Sicap and Red Bend Software. Sicap, the leader in server-side Device Management, and Red Bend, the leader in Mobile Software Management, announced their agreement to ensure interoperability between their products.
Sequence Design Speeds RTL Power Reduction with PowerArtist
Sequence Design introduced PowerArtist[tm], offering the industry’s fastest automated RTL power reduction – 10 to 50 percent or more depending on the design – in just minutes on a million-plus gate block. Unlike approaches limited by design size, PowerArtist has run on a 15M gate design in four hours within a 12GB footprint. PowerArtist will be featured in Sequence’s DAC Booth No. 2100.
DFMSim Debuts Virtual Factory Tool Suite for Semiconductor Manufacturers
Setting new performance standards for design-for-manufacturability (DFM) solutions, industry newcomer, DFMSim launched an innovative class of software tools that enable designers and manufacturers of complex integrated circuits (ICs) to accurately predict and avoid systemic errors that seriously impact manufacturing yields and harm their bottom lines.
802.11n WLAN DOCSIS 3.0 Gateway Reference Design with TI Puma 5
Ralink announced that its RT2880 iNIC Wi-Fi 802.11n solution supports Texas Instruments’ Puma 5 family of DOCSIS 3.0-based (Data Over Cable Service Interface Specification) cable modem chipsets. TI’s Puma 5 family is the industry’s first DOCSIS 3.0 compliant cable modem chipset providing a flexible and scalable platform that enables equipment manufacturers to meet the demand for next-generation voice, data and video solutions combined with advanced networking capabilities.