Tekmos TK68HC05B6 MCU Replaces Freescale MC68HC05B6 Microcontroller
Tekmos, a leader in legacy device replacements to extend product life of Microcontrollers, ASICs, Standard Products and FPGAs, has introduced the first true pin for pin, code and timing compatible drop in replacement for the MC68HC05B6 as offered by Freescale. The TK68HC05B6 provides 256 bytes of EEPROM, 16 bit timer, two PWM, watch dog timer, 8 channel A/D converter, 24 bit bi-directional I/O lines, on chip oscillator with crystal/ceramic resonator and serial communications.
Avago Technologies Develops Smallest RF Amplifier
Avago Technologies announced the world’s smallest RF amplifier. With miniature 0402 package dimensions and no wirebonds, the innovative VMMK-2×03 amplifiers experience almost no signal loss and minimal parasitics. Its ultra-small size and fully matched SMT design are optimized for 500 MHz to 12 GHz frequencies, making these high-performance devices ideal to place in a variety of radio architectures.
QuickLogic SDIO Host Controller Supports Multiple Cards, Mixed Sizes
Continuing its commitment to the mobile device market, QuickLogic® Corporation (NASDAQ:QUIK), has enhanced its proven SDIO host controller solution by providing it with the ability to handle multiple, independent memory cards. The enhanced host controller solution is a Proven System Block (PSB) of the company’s Customer Specific Standard Product (CSSP) solutions platform library, addressing the needs of handheld system designs.
Elma Electronic Announces Rugged MicroTCA ARINC 404A ATR Long Chassis
Elma Electronic Inc., a global manufacturer of electronic packaging products, has announced a ruggedized ATR chassis for MicroTCA. The new MicroTCA chassis is an ARINC 404A Full-Size ATR Long Enclosure, often used in commercial and military aviation. The rugged enclosure features modified front panels that can be secured to the chassis. This provides more protection for shock and vibration. Shock absorbers/dampers can also be added to the enclosure for extra protection.
AIC, Insyde to Demonstrate InsydeH2O UEFI Framework Firmware for Menlow
A.I. Corporation and Insyde Software announce their continued commitment to the embedded market with demonstrations of UEFI firmware solutions which include Menlow and other Intel chipsets at the Tokyo International Exhibition Center (Tokyo Big Sight) at the Embedded Systems Expo Show. Exhibiting in the Intel Pavilion, AIC will highlight Insyde Software’s InsydeH2O UEFI Framework firmware on Intel’s Menlow platform running Red Flag Linux operating systems.
Thames Innovation Centre The Embedded Masterclass
The annual UK technology conference for hi-tech engineers, the Embedded Masterclass, has enjoyed not only a 100% increase in delegate registrations but also its classiest venue to date. Hosted at the Thames Innovation Centre in outer London, the event included a tabletop exhibition in its impressive atrium, an agenda of technical presentations in its purpose built conference rooms and two technical workshops in its well equipped IT training room.
Synopsys Donates VMM Methodology for SystemVerilog to Accellera
Synopsys, Inc. (NASDAQ: SNPS) announced that it is donating its complete implementation of the proven VMM verification methodology for SystemVerilog, including the VMM Standard Library and VMM Applications, to Accellera to enable verification interoperability standardization. Accellera has accepted the donation so the recently formed Accellera Verification IP (VIP) Technical Subcommittee can use it for their standardization activities.
VeriSilicon Joins Power Forward Initiative
VeriSilicon Holdings Co., Ltd. (VeriSilicon), a world-class ASIC design foundry and custom solutions provider, has joined the Power Forward Initiative (PFI) and plans to offer a Common Power Format (CPF)-based design solution for its ASIC customers. VeriSilicon uses the Cadence® Design Systems, Inc. Low-Power Solution, the industry’s leading and complete flow that integrates logic design, verification, and implementation technologies with the Si2-approved Common Power Format.
Renesas Adopts Teradyne J750 Platform for Final Microcontroller Test
Teradyne, Inc. (NYSE: TER) announced Renesas Technology Corp. has standardized their microcontroller final test using the J750 Platform of test systems in Renesas Semiconductor (Beijing) Co., Ltd. Renesas, a joint venture of Hitachi, Ltd. and Mitsubishi Electric Corporation formed in 2003, currently uses the J750 Platform for volume production in China and Japan.
IDC Publishes Latest Research on Worldwide EMS Industry
The worldwide electronic manufacturing services industry grew at the annual rate of 17% in 2007, generating $268.1 billion in revenues, according to new research from IDC. While the original design manufacturer (ODM) sector continued to grow at the higher rate of 23% in 2007, the EMS sector still accounted for more than 60% of the industry. The two largest product segments remained computers and consumer devices, generating 36% and 29% of the EMS industry revenue respectively.
Renesas Tapes Out Large Scale Chip Design with Cadence SoC Encounter
Cadence Design Systems, Inc. (NASDAQ: CDNS) announced that Renesas Technology Corp. has taped out an advanced and large-scale system-on-chip design to date using the Cadence SoC Encounter system. Encounter’s complete end to end digital implementation and analysis solution, including innovative design planning, hierarchical modeling, and flip-chip technologies, dramatically reduced design cycle time and silicon costs while accelerating overall timing closure and time to market.
Socle Selects Cadence Low-Power Solution for Socle SoC-ImP Solution
Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic design innovation, announced that Socle Technology, a leading system-on-chip design service and solution provider in Taiwan, has adopted the Cadence Low-Power Solution for the Socle SoC-ImP solution, an ultra-deep submicron implementation platform for SoC design. The Cadence Low-Power Solution enables Socle to leverage innovative low-power techniques to solve power challenges at 65 nanometers and below.