Apache Design Offers Chip Package Co-Design Methodology Webinar
Apache Design Solutions, the technology leader in power, noise, and reliability (PNR) signoff for chip, package, and system designs, announced that the company will present an online technical webinar entitled “Chip-Package Co-Design: Applying Chip Power Model in System Power Integrity Analysis.” Apache will detail the methodology used for integrated chip-package co-design based on a Chip Power Model (CPM), as well as design examples to demonstrate application and results.
Strategy Analytics Ranks Freescale First in Automotive Semiconductor
In the race to feed the automotive industry’s growing appetite for silicon, Freescale Semiconductor wins again, year after year. Strategy Analytics’ 2007 Automotive Semiconductor Vendor Market Share report names Freescale as the No. 1 supplier to the automotive industry – the 17th year in a row that Freescale has topped the charts in the analyst firm’s annual report.
Avago Technologies Creates Thinnest Autofocus LED for Digital Cameras
Avago Technologies, a leading supplier of analog interface components for communications, industrial and consumer applications, announced a new miniature autofocus light emitting diode (LED) for use in ultra-slim digital still camera and cell phone designs. Avago’s ASMT-FJ30 is the thinnest autofocus LED in the industry and can play a key role in helping digital still camera and camera phone designers to further reduce the overall thickness of those applications.
Elma Announces Extruded AdvancedTCA Front Panels
Elma Electronic Inc., a global manufacturer of electronic packaging products, has announced AdvancedTCA (ATCA) front panels that offer a more precise and finished look that typical stamped sheet metal versions. Elma offers the extruded ATCA panels in two versions. The first version has a .5 mm deep channel for overlays (typically a printed lexan substrate with pressure-sensitive adhesive on the back side) to be placed.
NI Releases USB-6212, USB-6216 Bus Powered DAQ Devices for USB
National Instruments (Nasdaq: NATI) announced the release of two new bus-powered M Series data acquisition (DAQ) devices for USB that deliver faster sampling rates and more digital I/O features than previously released bus-powered M Series devices for USB. The NI USB-6212 and USB-6216 are available with 68-pin SCSI mass termination, screw terminals or 50-pin IDC connectivity to provide multiple connectivity options.
Agilent Technologies Introduces WVAN Wireless Library
Agilent Technologies Inc. (NYSE:A) introduced a WVAN Wireless Library that helps prevent unnecessary wafer spins, thus accelerating deployment of next-generation 60 GHz wireless video area networks (WVAN) for high-volume consumer video equipment. The library is for use with Agilent’s Advanced Design System (ADS) EDA software.
Intel, Samsung, TSMC Agree on 450mm Wafer Manufacturing Transition
Intel Corporation, Samsung Electronics and TSMC announced they have reached agreement on the need for industry-wide collaboration to target a transition to larger, 450mm-sized wafers starting in 2012. The transition to larger wafers will enable continued growth of the semiconductor industry and helps maintain a reasonable cost structure for future integrated circuit manufacturing and applications.
Genesys Adds Design for Leakage Test to HiertestMaker Hierarchical Scan
Genesys Testware, Inc., a leading supplier of yield, quality and cost optimization tools for nanometer ICs, announced the addition of Design For Leakage Test (DFLT) features to its hierarchical scan test tool, HiertestMaker[TM]. Reducing power dissipation and energy use is the biggest challenge facing IC designers today. Leakage is the largest contributor to IC power and energy for designs manufactured using advanced manufacturing processes.
The MathWorks Extends Simulink with Communications Blockset 4
The MathWorks announced the availability of Communications Blockset 4, which extends Simulink with a comprehensive library of blocks for designing, simulating, and verifying the physical layer of communication systems. The latest version provides enhanced support for code generation and examples of important features of WiMAX and Long Term Evolution (LTE) communications systems. The code generation capability enables faster simulation on multicore computers.
Lawrence Berkeley National Laboratory, Tensilica Team on Supercomputing
Tensilica®, Inc. and the U.S. Department of Energy’s Lawrence Berkeley National Laboratory announced a collaboration program to explore new design concepts for energy-efficient high-performance scientific computer systems. The joint effort is focused on novel processor and systems architectures using large numbers of small processor cores, connected together with optimized links, and tuned to the requirements of highly-parallel applications such as climate modeling.
VirtualLogix Debuts VLX vHA High Availability Virtualization Solution
VirtualLogix(tm), Inc., the Real-Time Virtualization(tm) company, introduced VLX vHA, the industry’s first solution that enables high-availability (HA) assurances for communications equipment utilizing virtualization. Tightly integrated with its award-winning, real-time virtualization solution for network equipment, VLX for Network Infrastructure, VLX vHA increases system availability without the cost and scalability restrictions of traditional solutions.
CSR Selects Novas Verdi, Siloti Solutions for Enhancing Verification
Novas Software, Inc., the leader in debug and visibility enhancement solutions for complex chip designs, announced that CSR (LSE:CSR), a wireless solutions provider and leader in Bluetooth technology, is expanding its deployment of Novas debug automation and visibility enhancement solutions to enhance its verification methodology.