NEC Electronics America Unveils New Amorphous Silicon TFT LCD Modules
NEC Electronics America, Inc. strengthened its mid-size industrial offering with the addition of four new amorphous-silicon thin-film-transistor (TFT) liquid crystal display (LCD) modules ranging in size from 8.4 to 12.1 inches from NEC LCD Technologies. The new modules deliver improved visibility for a variety of industrial applications, including factory automation equipment and measuring instruments.
Interface Masters Technologies Debuts Niagara 2710 10GbE Bypass NIC
Interface Masters Technologies, an industry leader and innovator in networking solutions, introduced the new 10 Gigabit Ethernet (10GbE) PCI Express Internal Bypass product line designed to support 10 Gigabit rates and throughput of inline Internet Security appliances, WAN Acceleration Systems, Gateways and network servers. The 10 Gigabit Bypass Network Interface Card (NIC) retains link and traffic forwarding based on Interface Masters unique Bypass technology.
PI Shrinks P-653 Piezo Ceramic Motor Linear Slide
PI’s patented P-653 piezo motor linear slide is significantly smaller than other miniature linear stages and provides significantly higher velocities and resolution. This true linear motor system (no conversion of rotation) consists of only 4 parts and can replace classical drive elements like miniaturized motor/lead screw systems or other linear motors, which P-653 outclasses with its speed of up to 200 mm/sec (8″/sec) and auto-locking feature.
One RF Technology Introduce TinyOne 868 MHz USB Dongle Modem
One RF Technology, experts in low-power wireless and front-runners of European ZigBee technology, has developed a small sized 868 MHz USB Dongle modem to facilitate the control and monitoring of wireless sensors networks based on the company’s low-power 868 MHz Mesh technology. Based on the company’s TinyOne Lite or Plus radio solutions, the 868 MHz USB Dongle modems offer the customers simple plug&play connectivity to a notebook or a handheld device.
Domosys Rolls Out DIN PowerGate Three Phase Module
Domosys Corporation, a leading provider of Power Line Communication (PLC) technology, is proud to announce the release of yet a new member of its DIN PowerGate product family, the DIN PowerGate Three-Phase module. This new product fully supports Domosys’ PowerBus(TM) RHINO Technology. The DIN PowerGate Three-Phase module allows connection to the typical three-phase circuits found in commercial buildings and in some sub-stations.
One RF Showcases Low-power Wireless Temperature Monitoring Solution
One RF Technology, experts in low-power wireless and front-runners of European ZigBee technology, presents it’s low-power wireless temperature monitoring solution at the Hanover Industry Fair in Germany. The solution offers many years of autonomous operating time with a standard lithium AA battery. There are many critical applications that depend on temperature regularity.
Cadence Virtuoso Spectre Circuit Simulator Features Turbo Technology
Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic-design innovation, announced the immediate availability of advanced “turbo” technologies within the Cadence® Virtuoso® Spectre® Circuit Simulator, the industry’s leading analog SPICE circuit simulator with comprehensive foundry support. The turbo technology boosts performance while ensuring silicon accuracy, enabling designers to verify their complex large analog designs.
Semiconductor Test Consortium Announces 2008 Global STC Conference
The Semiconductor Test Consortium, Inc. (STC), the leading proponent of the development and adoption of value-added open test standards that benefit the semiconductor industry, announced the dates for the annual Global STC Conference (GSC) and revealed this year’s theme of “Collaborative Solutions Beyond 2010.” This interactive global forum, open to both STC member and non-members, will be held on June 4th-6th in San Diego, California.
Cadence Debuts RTL to GDSII Reference Flows for ARM Cortex-A9
Cadence Design Systems, Inc. (NASDAQ: CDNS) announced the immediate availability of multiple, silicon-ready RTL to GDSII implementation flows based on the Cadence® Encounter® digital IC design platform, for the ARM® Cortex(tm)-A9 processor. The flows are available for three configurations of the ARM Cortex-A9 processor: single core, dual Cortex-A9 MPCore(tm) multicore processor and quad Cortex-A9 MPCore(tm) multicore processor.
Cadence Announces Production Proven Enhancements for Custom IC Design
Cadence Design Systems, Inc. (NASDAQ: CDNS) announced a broad array of new custom IC design capabilities that help chip makers accelerate volume production of large, complex designs, especially at advanced node processes of 65 nanometers and below. These production-proven enhancements to the Virtuoso® suite of technologies further strengthen the holistic approach Cadence® has taken to reduce risk and boost productivity while managing scale and complexity.