PHYTEC Releases phyCORE-LPC3250 ARM9 Single Board Computer
PHYTEC announces the release of its new phyCORE-LPC3250 Single Board Computer (SBC) subassembly. The phyCORE-LPC3250 is an ARM9 based, small form factor (70×58 mm), OEMable module populated with the NXP LPC3250 microcontroller. The LPC3250 can operate in ultra-low-power mode down to 0.9V. The State-of-the-art power management, Floating Point Unit, and rich peripherals. The phyCORE-LPC3250 is suitable for consumer, industrial, medical, and automotive applications.
Agilent Releases GoldenGate 4.2 RFIC Simulation Software
Agilent Technologies Inc. (NYSE:A) announced the release of the latest version of its RFIC simulation software, GoldenGate. This release represents an expansion in RFIC simulation coverage for wireless communications products, with 5x transient simulation speed improvements and new mixed-signal simulation capabilities, resulting in shorter product development times.
Spectrum Control Develops Dual Frequency Patch Antenna
Spectrum Control, Inc. has designed a new single element patch antenna that can receive and/or transmit two frequency bands in one 45mm package. This dual frequency patch antenna provides a space and cost savings compared to using two, single frequency patch antennas. The patch antennas were developed for GPS (global positioning systems) using Globalstar: telephone & low-speed data communications or Iridium: voice & data communications using handheld satellite phones.
Interphase, 6WIND Team on Integrated Packet Accelerator Products
Interphase, a leader in embedded networking solutions, announced its partnership with 6WIND, a leader in embedded networking software. Initially this integration will be completed on the Interphase iSPAN(tm) 36CA AdvancedMC(tm) and iSPAN(tm) 55CA PCI-X Cavium Networks OCTEON(tm) packet accelerator cards. This partnership will address the company’s customer need for the highest performance multi-core processors in both rack mount server and AdvancedTCA® architectures.
ChipVision Debuts PowerOpt, P-SAM ESL Power Optimization Design Tools
ChipVision Design Systems, the low-power specialist in electronic design automation (EDA), announced two breakthrough products – PowerOpt(tm) and P-SAM – that help companies meet their power budget requirements early in the design cycle. The new tools are ideal for companies developing mobile communications, networking, consumer or automotive applications that need extended battery life or reduced cooling requirements.
Court of Appeals for DC Circuit Overturns FTC Orders in Rambus Case
Rambus Inc. (Nasdaq:RMBS), one of the world’s premier technology licensing companies specializing in high-speed memory architectures, announced that the US Court of Appeals for the DC Circuit has overturned the Federal Trade Commission’s (FTC) decisions regarding Rambus, and remanded the matter back to the FTC for further proceedings consistent with the Court’s opinion.
TSMC Announces 40/65 Nanometer SPICE Tool Qualification Program
Taiwan Semiconductor Manufacturing Company, Ltd. (TSE: 2330, NYSE: TSM) unveiled a SPICE Tool Qualification Program that drives its Design Service ecosystem partners to develop SPICE simulators with greater accuracy and higher performance. Targeting TSMC’s 65-, 40-nanometer and smaller geometry process technologies, the program’s benefits include improved device model accuracy, enhanced simulation efficiency, and compatibility across a wide selection of SPICE simulators.
MSC Vertriebs Joins Qseven Consortium
MSC Vertriebs GmbH has joined the group of founder members of the Qseven consortium, thus underlining their active support of the small form-factor 70 mm x 70 mm. The Qseven platform was developed especially with respect to highest performance capability with the most possible flexibility in the choice of processors. The compact dimensions and extremely low power consumption of the Qseven module technology is possible thanks to new, highly integrated and low power processors.
Red Bend Software to Expand with New $10 Million Funding
Red Bend Software, the market leader in Mobile Software Management (MSM), announced that it has secured $10 million in funding to fuel the company’s expansion into the mobile and machine-to-machine (M2M) markets. The funding was led by new investor Coral Capital Management, joined in the round by Red Bend’s existing investors: Carmel Ventures, Greylock Partners, Pitango Venture Capital, Poalim Ventures and Infinity.
IBM Licenses Rambus Multi-Protocol SerDes
Rambus Inc. (NASDAQ:RMBS), one of the world’s premier technology licensing companies specializing in high-speed memory architectures, announced that IBM has licensed Rambus’ multi-protocol SerDes (Serial/Deserializer) cell designed for advanced networking, server and general ASIC applications. This sophisticated multi-protocol SerDes cell provides IBM with a high-performance and low-power solution for implementation on its 45nm silicon-on-insulator (SOI) technology.
TTM Selects Cadence SoC Encounter XL System, Litho Physical Analyzer
Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic-design innovation, announced that Time To Market, Inc. (TTM), a leading ASIC design house, was able to detect hot spots and optimize yields for a complex 65-nanometer design using a holistic design-for-manufacturability flow from Cadence that includes the Cadence® SoC Encounter(tm) XL system and the Cadence Litho Physical Analyzer.
Gleichmann Announces 110 Degrees C NEC PS2561B Optocoupler
Gleichmann Electronics announces immediate availability of NEC Electronics’ PS2561B high temperature optocoupler for operation at up to 110°C ambient temperature. The PS2561B device features a high isolation voltage of 5000 Viso. In addition, the optocoupler is suitable for input currents from 1mA to 5mA. Output collector to emitter voltages of up to 80V can be applied and maximum output current is 50mA.