RadiSys Introduces Procelerant Z500 Module with Intel Atom Processor
RadiSys Corporation (NASDAQ: RSYS), a leading global provider of advanced embedded solutions, announced the introduction of the RadiSys Procelerant® Z500 module, a 85mm x 70mm module compatible with the Type 2 COM Express pin-out. Manufacturers of handheld and mobile equipment for industrial automation, gaming, test & measurement, and military applications now have an ultra low power module, based on the high-performance Intel® Atom(tm) processor Z500 series.
Elma Electronic Announces LED Lightpipes
Elma Electronic, a leading designer and manufacturer of rotary components and electronic packaging products, offers new lightpipes that provide distinct color output. The Elma lightpipes have optional barriers that prevent color mixing from adjacent rows. Each pipe in the LED array can block interfering light from other pipes. Sometimes these pipes are too close together and the colors can blend.
Texas Instruments ESC Booth Features Radiocrafts Modules
Radiocrafts AS, a leading supplier of wireless RF modules for communication in the license-free frequency bands, will present new additions to their wide range of RF modules at the Texas Instruments (TI) booth (#1708) at the Embedded Systems Conference (ESC) in San Jose, California, April 17, 2008. Last year Radiocrafts was selected by Texas Instruments as a 3rd-party provider of modules and engineering services for their low-power wireless products.
Silicon Laboratories Unveils Si2161, Si2165 Digital Video Demodulators
Silicon Laboratories Inc. (NASDAQ: SLAB), a leader in high-performance, analog-intensive, mixed-signal ICs, announced the Si2161 and Si2165 digital video demodulators, the smallest, lowest power and highest performance demodulator solutions to support DVB-T, DVB-C and fixed reception DVB-H in a single chip. The new Si2161/2165 demodulators are ideal for equipment receiving digital terrestrial and/or cable services.
TI Debuts Multi-Carrier, Multi-Standard Platform for Base Stations
Texas Instruments Incorporated (TI) [NYSE: TXN] announced a scalable, programmable development ecosystem enabling base station OEMs to support multiple carriers of established and evolving wireless standards from a single platform. Based on TI’s multicore TMS320TCI6487 and TMS320TCI6488 digital signal processors (DSPs) and multi-interface software libraries, the development platform covers all major air interfaces including GSM-EDGE, HSPA, HSPA+, TD-SCDMA , LTE and WiMAX.
PLX Selects Cadence Incisive Palladium II Accelerator Emulator
Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic-design innovation, announced that PLX Technology, the world’s leading supplier of PCI Express® switch and bridge silicon for the communications, server, storage and embedded markets, has adopted the Cadence® Incisive® Palladium® II Accelerator/Emulator for its advanced system-level verification needs.